Featured Content




SiFive joins TSMC IP Alliance Program

09/26/2017  SiFive today announced it has joined the TSMC IP Alliance Program, part of the TSMC Open Innovation Platform, which accelerates innovation in the semiconductor design community.

Graphene forged into three-dimensional shapes

09/26/2017  Researchers from Finland and Taiwan have discovered how graphene, a single-atom-thin layer of carbon, can be forged into three-dimensional objects by using laser light. A striking illustration was provided when the researchers fabricated a pyramid with a height of 60nm, which is about 200 times larger than the thickness of a graphene sheet.

Understanding the impact of valve flow coefficient (Cv) in fluid systems

09/26/2017  Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

Cree names Gregg Lowe as CEO

09/25/2017  Mr. Lowe succeeds Chuck Swoboda, per the transition plan announced in May.

Cypress appoints Jeff Owens to Board of Directors

09/25/2017  Cypress Semiconductor Corp. today announced the appointment of Jeffrey J. Owens to its board of directors.

Measuring metals, dielectrics, resists and CDs in advanced packaging

09/25/2017  A new system combines acoustic, optical and reflectometric techniques to enable measurement of metals, dielectrics, resists and critical dimensions on a single platform.

Samsung certifies Synopsys Design Platform for 28nm FD-SOI process technology

09/25/2017  Synopsys, Inc. today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology.

Applied Materials focuses on enabling artificial intelligence era at 2017 Analyst Day

09/22/2017  Applied Materials, Inc. will explore the future of computing in the era of artificial intelligence (A.I.) at its 2017 Analyst Day on Wednesday, September 27 in New York.

North American semiconductor equipment industry posts August 2017 billings 

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Synopsys Design Platform certified by GLOBALFOUNDRIES for 22nm FD-SOI process technology

09/21/2017  GF worked closely with Synopsys to complete the rigorous certification process of the Synopsys Design Platform on our 22FDX process platform.

Scientists make atoms-thick Post-It notes for solar cells and circuits

09/21/2017  A study led by UChicago researchers describes an innovative method to make stacks of semiconductors just a few atoms thick. The technique offers scientists and engineers a simple, cost-effective method to make thin, uniform layers of these materials, which could expand capabilities for devices from solar cells to cell phones.

Application of air-sensitive semiconductors in nanoelectronics

09/21/2017  2-D semiconductor gallium selenide in encapsulated nanoelectronic devices.

Automated thickness measurement system speeds production

09/20/2017  ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers.

Leti develops proof of concept to test wireless systems in aircraft

09/20/2017  Leti, a technology research institute of CEA Tech, announced today it has developed a methodology for testing high-speed wireless communications on airplanes that allows different system deployments in cabins, and assesses wireless devices before they are installed.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A ManufacturerÂ’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factoriesÂ’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but MicrosoftÂ’s Sanjay Ravi explained in Wednesday morningÂ’s keynote that this innovation is becoming available now to manufacturers.