Featured Content




Mind the (global perspective) gap

05/01/2007  What’s the biggest barrier to small-tech commercialization today? Is it a lack of standards? Manufacturing or infrastructure challenges? Shortage of a qualified workforce? Intellectual property or EH&S (environmental, health, and safety) concerns?

Designing molecular machines from the comfort of home

05/01/2007  Tom Moore, a nanotechnology blogger, has set up a Machine Phase blog at http://machine-phase.blogspot.com to chronicle his nanotechnology adventures designing molecular machines using NanoEngineer-1 software from Nanorex.

Air Liquide receives TI award

05/01/2007  Air Liquide Electronics U.S. LP was recently presented with the Texas Instruments (TI) 2006 Supplier Excellence Award in recognition of its bulk gas operations services for TI over the past calendar year.

Students’ cars drive the power of nanotechnology

05/01/2007  Fuel-cell-powered balsa-wood cars are driving students from Broadlands, Ill.-based Heritage High School into the age of nanotechnology.

Kohrt examines energy/education

05/01/2007  Managing industrial innovation is a challenge, whether in a corporate setting or in research.

How Germany nurtures its nanotech industry

05/01/2007  The country supports innovators in interesting ways.

Meeting production pressures

05/01/2007  Are today’s test-and-measurement tools up to the demands of high-volume small-tech manufacturing?

Educating small tech’s revolutionaries

05/01/2007  Institutions that teach skills and nurture innovation: A guide for students, researchers, inventors, and CEOs

Are no nodes good news?

05/01/2007  When Intel (Santa Clara, CA) recently announced volume manufacturing in the second half of 2007 of a 45 nm process, something was missing: mention of a technology node.

Hyaluron reconfigures cleanroom for formulation/fill operations

05/01/2007  With the February announcement of a $1 million low-interest loan provided by MassDevelopment, Massachusetts’ finance and development authority, and Middlesex Savings Bank, pharmaceutical biotech contract manufacturer Hyaluron Contract Manufacturing, Inc. (HCM) is able to restructure the cleanroom and manufacturing space at its Burlington, MA-based headquarters as well as purchase backup systems for its electrical, HVAC, and mechanical infrastructure.

Examining solar panel manufacturing requirements

05/01/2007  As oil prices continue to climb and environmental concerns grow, the demand for and interest in solar power as an alternative to fossil fuel has increased dramatically.

Bump Coplanarity

05/01/2007  One of the most important measurements when designing an automated optical inspection (AOI) of solder bumps is bump coplanarity. Remarkably, the appropriate JEDEC specification (JESD22-B108A) defines bump coplanarity in a way that could give misleading results.

Understanding particle counting technology

05/01/2007  The original method for counting particles was to count them visually, through a microscope, a tedious, error-prone process that has mostly been replaced by optical particle counters.

Environmental applications of 21CFR Part 11 for pilot operations

05/01/2007  By now we have all heard of, and most likely been affected by, the regulations of 21CFR Part 11. Now we’re at the point in the regulations evolution where we can draw on some practical experience and apply this to improve our facilities even further.

In-house vs. contract manufacturing

05/01/2007  As a pharmaceutical start-up matures, it must face an unavoidable decision: whether to develop, test, and produce its new product in-house or to outsource it.

Contamination control consulting

05/01/2007  Contamination control is a critical factor in research and manufacturing facilities.

Listening to the users

05/01/2007  In the universe of contamination control technology, there are various products and solutions ranging from “high-tech” to “low-tech” offerings.

Investigating toxicology in nanotechnology

05/01/2007  The safety (toxicity) of nanoscale materials is largely an unknown. This is a significant knowledge void that should be considered and rectified.

Challenges in Flip Chip Assembly

05/01/2007  Flip chip on substrate assembly has been a placid technical field, with a mainstream high-volume manufacturing process carefully shepherded by production engineers towards raising yields and increasing line throughput.

Handling Ultra-thin Wafers

05/01/2007  Manufacturing technologies for 50- to 150-µm thin wafers are a basic need for a wide variety of microelectronic products.