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Thermally Conductive Adhesive Tapes

05/01/2007  A well-designed thermal management system involves efficient heat-dissipating components such as heatsinks, air or liquid cooling pipes, and fans. To maximize heat dissipation, choosing the right thermal interface material (TIM) is critical.

Sockets Meet Future Technology Challenges: Part II

05/01/2007  In the March 2007 cover story, we asked the industry about the demands that new packages placed on sockets, lead-free issues, standards, cost control, fine pitch, and the overall consensus on the Burn-in & Test Sockets Workshop (BiTS) where users talk to suppliers.

Clip Bonding on High-power Modules

05/01/2007  Increasing power levels and power density requirements for multiple end products means that high-power semiconductor modules and components are often assembled using a clip-bonding technology.

Extreme Environment Advancements

05/01/2007  Extreme-environment electronics operate in conditions outside the parameters of mainstream electronics.

Semiconductor Packaging Outlook

05/01/2007  s semiconductor technologies mature, keeping up with Moore’s Law becomes progressively tougher.

In the Wild, Wild West

05/01/2007  Amkor Technology, Chandler, AZ

Packaging Talk

05/01/2007  I’ve always thought that packaging was sexy.

SIA: March chip sales up, despite ASP/sales slumps

04/30/2007  April 30, 2007 - Pricing woes continued in March across major markets in the semiconductor industry, which all saw sales decline despite higher unit shipments, according to the SIA's latest monthly data. Overall chip sales managed to inch up in March and 1Q07, but are still well below expectations.

Hynix: DRAM sales helped by bit growth, capacity shift -- at expense of NAND

04/30/2007  April 30, 2007 - Memory maker Hynix says its sales and operating profits took a hit in 1Q due to sharp price declines in both DRAM and NAND, but the DRAM side was offset by surging bit growth and a shift in capacity, at the expense of NAND flash operations.

Analyst: AMAT, Rohm/Haas still dominate CMP

04/30/2007  April 30, 2007 - The market for chemical mechanical planarization (CMP) equipment and materials kept apace with the overall semiconductor equipment market in 2006, growing at about 24%, but despite a growing number of competitors two stalwarts still dominate the market, according to market research firm The Information Network.

Hynix breaks ground on $4.1B fab

04/30/2007  April 30, 2007 - Hynix Semiconductor Inc. says it has begun construction of its new 300mm facility, Fab M-11, in Cheongju, North Chungcheong province, which it plans to have up and running by 3Q08 for sub-48nm NAND flash memory production. Total investment is projected to be about $4.10 billion over roughly 2.5 years.

IEEE invites input on nanoelectronics roadmap

04/30/2007  The IEEE is inviting feedback on its newly completed Nanoelectronics Standards Roadmap. The roadmap establishes a framework for creating standards to help commercialize nanotech-based electronics applications.

Agilent offers trade-in discount on new AFMs

04/30/2007  Agilent Technologies is offering a trade-in promotion until Sept. 15, 2007: The company will take 25% off the price of a new 5500 and 5400 atomic force microscope (AFM) for customers in the U.S., U.K., Germany, and Japan who trade in an older AFM.

U of Missouri's "pseudo element" may change electronics, disease treatment

04/30/2007  A new discovery by a University of Missouri-Columbia research team, now published in Angewandte Chemie (the journal of the German Society of Chemists), allows scientists to manipulate a molecule discovered 50 years ago to exhibit metal-like properties, creating a new, "pseudo" element. The pseudo-metal properties can be adjusted for a range of uses.

FDA's update on tainted pet food

04/28/2007  April 22, 2007 -- /FDA News/ -- The U.S. Food and Drug Administration (FDA) is investigating an imported shipment of rice protein concentrate which has been found to contain melamine.

FDA seizes all medical products from NJ device manufacturer

04/28/2007  April 23, 2007 -- /FDA News/ -- U.S. Food and Drug Administration (FDA) investigators and U.S. Marshals on April 17 seized all implantable medical devices from Shelhigh, Inc., Union, NJ, after finding significant deficiencies in the company's manufacturing processes.

3Dsolve adds board member to help create aseptic training simulations for the pharmaceutical industry

04/28/2007  April 24, 2007 -- CARY, NC -- 3Dsolve, The Simulation Learning Company, is proud to announce the addition of Dr. Carmen M. Wagner to its advisory board. Wagner, the founder and president of Strategic Compliance International, will provide guidance to 3Dsolve as it develops multiuser, high-fidelity e-learning software for pharmaceutical companies worldwide.

Worldwide Fish & Seafood, Inc. enters consent decree with FDA

04/28/2007  April 20, 2007 -- /FDA News/ -- The U.S. Food and Drug Administration (FDA) today announced that Worldwide Fish & Seafood, Inc., Minneapolis, MN, (doing business as Coastal Seafood) a seafood processor and three of its officers have entered into a consent decree of permanent injunction due to violations of the Federal Food, Drug and Cosmetic Act.

HFX Corp. announces voluntary meat recall in consultation with USDA

04/28/2007  April 20, 2007 -- /PRNewswire/ -- CLAYSBURG, PA -- HFX Corp. announced today that the company has issued a voluntary recall for 259,230 pounds of beef products due to a possible contamination with E. coli 0157 bacteria.

Chartered profit flat Q-Q, sales dip

04/27/2007  April 27, 2007 - Singapore foundry Chartered Semiconductor Manufacturing says 1Q profits were up slightly to $5.3 million vs. 4Q06, but were well off year-ago earnings of $22.0 million, while revenues were off both Q-Q and Y-Y due to excess inventory and seasonal declines. 2Q should be a bit better, but ASPs are seen still sliding by as much as 16%.