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Seoul Semiconductor files patent litigation for infringement of 12 Acrich patents

09/19/2017  Seoul Semiconductor Co., Ltd. announced on Sept. 19, 2017 that it has filed a patent infringement lawsuit, together with its affiliate, Seoul Viosys Co., Ltd., against Archipelago Lighting, Inc. in the U.S. District Court for the Central District of California.

Graphene and other carbon nanomaterials can replace scarce metals

09/19/2017  Scarce metals are found in a wide range of everyday objects around us. They are complicated to extract, difficult to recycle and so rare that several of them have become "conflict minerals" which can promote conflicts and oppression. A survey at Chalmers University of Technology now shows that there are potential technology-based solutions that can replace many of the metals with carbon nanomaterials, such as graphene.

GLOBALFOUNDRIES and Soitec enter into long-term supply agreement on FD-SOI wafers

09/19/2017  GLOBALFOUNDRIES and Soitec today announced that they have entered into a five-year agreement to ensure the volume supply of state-of-the-art fully depleted silicon-on-insulator (FD-SOI) wafers.

SEMI and SAE announce strategic partnership

09/19/2017  The future of smart, self-driving cars means massive change for electronics suppliers, from advanced internal networks, to 5G communications with the road ahead ? and even AI drivers' licenses.

Samsung Electronics joins Semiconductor Research Corporation on research consortium

09/19/2017  Semiconductor Research Corporation (SRC), today announced that Samsung Electronics Company Ltd. (Samsung), one of the world's largest chipmakers, has signed an agreement to join SRC's research consortium. Samsung will participate in two SRC platforms – the New Science Team (NST) project and the Global Research Collaboration (GRC) program.

DARPA calls for Monolithic 3D – 3DSoC

09/19/2017  Learn all about Monolithic 3D at IEEE S3S.

Cadence recognized with three TSMC Partner of the Year awards

09/18/2017  Cadence Design Systems, Inc. today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform (OIP) Ecosystem Forum.

Andrew Wilson elected to Intel Board of Directors

09/18/2017  Intel Corporation today announced that Andrew Wilson, CEO of Electronic Arts Inc., has been elected to Intel's board of directors. Wilson's election brings Intel's board membership to 12.

GLOBALFOUNDRIES announces enhanced RF SOI process design kit

09/18/2017  GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

Scientists demonstrated 1.3 ?m submilliamp threshold quantum dot micro-lasers on Si

09/18/2017  Decades ago, the Moore's law predicted that the number of transistors in a dense integrated circuit doubles approximately every two years. This prediction was proved to be right in the past few decades, and the quest for ever smaller and more efficient semiconductor devices have been a driving force in breakthroughs in the technology.

2-D Electronics' metal or semiconductor? Both

09/18/2017  IBS researchers produced the first 2D field-effect transistor (FET) made of a single material.

IMAPS 2017 to showcase advances in microelectronics technology

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

Driven by TV size migration, large TFT display market continues to grow 6% by area in 2017

09/15/2017  The large thin film transistor (TFT) display market is expected to continue to expand in 2017 despite slower end-market demand, according to IHS Markit.

Entegris launches Oktolex membrane technology to improve yield In ArF, KrF and EUV lithography

09/15/2017  Entegris Inc. announced at SEMICON Taiwan today the availability of its Oktolex membrane technology for advanced point-of-use photolithography applications.

Cadence appoints John Wall as next Chief Financial Officer

09/15/2017  Cadence Design Systems, Inc. today announced that John Wall, corporate vice president of finance and corporate controller of Cadence, has been appointed senior vice president and chief financial officer of Cadence, effective October 1, 2017.

Flex Logix wins TSMC Open Innovation Platform Partner Of The Year Award 2017

09/15/2017  Flex Logix Technologies, Inc., a supplier of embedded FPGA IP and software, today announced it has won the TSMC Open Innovation Platform's Partner of the Year Award 2017 in the category of New IP for its EFLX embedded FPGA IP product.

TowerJazz announces 5V 65nm CMOS & low voltage power process

09/15/2017  TowerJazz, the global specialty foundry, today announced the release of its advanced 5V 65nm power process providing customers with multiple advantages over 0.18um 5V technologies.

New insights into nanocrystal growth in liquid

09/15/2017  Understanding process that creates complex crystals important for energy applications.

New study on graphene-wrapped nanocrystals makes inroads toward next-gen fuel cells

09/14/2017  Simulations and analysis at Berkeley Lab provide new atomic-scale clues to material's enhanced hydrogen storage properties.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.