04/01/2007 If you had told me seven years ago that the industry would consider spending around $30 million for lithography tools (immersion 193 nm), I would have laughed out loud.
04/01/2007 Advanced Packaging talked with IMEC’s Ann Witvrouw about recent developments in MEMS and CMOS processing, and how the technology could lead to advanced packaging techniques across the spectrum of MEMS structures.
04/01/2007 The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high.
03/30/2007 March 30, 2007 - Winbond Electronics Corp. says it will sell its 200mm DRAM fab in Taiwan's Hsinchu Science Park to Vanguard International Semiconductor Corp. (VIS) for about $251 million, including the facility and equipment parts, according to local media reports.
03/30/2007 The U.S. Display Consortium (USDC) elected Michael McCreary as chairman of the consortium's governing board. James R. Buntaine, Ph.D., of Eastman Kodak; Steven Frilich, Ph.D., of DuPont; and Daniel Gamota, Ph.D., Motorola, also joined the board.
03/30/2007 March 30, 2007 - Adoption of thin-film technology by solar cell manufacturers seeking an alternative to scarce and expensive polysilicon opens up new growth opportunities for production equipment suppliers, notes analyst firm The Information Network in a new report.
03/30/2007 RVSI Inspection LLC is relocating and expanding its Singapore offices for package and wafer inspection. The site will include a demonstration, applications, and training facility.
03/30/2007 Swiss venture capital firm NanoDimension's new investment vehicle, NanoDimension Limited Partnership, will focus exclusively on nanotechnology companies. It has already invested in French MRAM developer Crocus Technology SA.
03/30/2007 Korean companies Dongbu Electronics and Dongbu Hannong Chemicals have agreed to merge to form a bio-semiconductor enterprise, Dongbu HiTek Co., Ltd. The new company will launch May 1 to provide wafer foundry services and advanced chemicals and materials for agriculture, bioengineering, nanotechnology, and semiconductor processing.
03/29/2007 March 29, 2007 - Applied Materials Inc. has extended its services partnership with Indian IT services firm Satyam Computer Services Ltd. in a new signed a five-year, $200 million contract, under which Satyam will provide application development, maintenance, and support (ADMS), as well as "business transformation" technology services, via a managed services delivery model.
03/29/2007 March 29, 2007 - An investment company held by Taiwan's Formosa Plastics Group, which owns stakes in memory makers Nanya Technology Corp. and Inotera Memories, has purchased 78 hectares of land in a high-tech park in Taoyuan County for about $233 million, where it will expand semiconductor related businesses including silicon wafer prduction and chip assembly, according to the Taiwan Economic News.
03/29/2007 March 29, 2007 - Intel reportedly has been notified by the IRS that the government agency has closed an examination of the company's taxes from 1999-2002 and 2003-2005 regarding taxing of export sales.
03/29/2007 March 29, 2007 - ARC International says it has signed licensing agreements with four Asia-based semiconductor companies for its configurable technologies to create system-on-chips (SoC).
Korean companies Dongbu Electronics and Dongbu Hannong Chemicals have agreed to merge to form a bio-semiconductor enterprise, Dongbu HiTek Co., Ltd. The new company will launch May 1 to provide wafer foundry services and advanced chemicals and materials for agriculture, bioengineering, nanotechnology, and semiconductor processing.