12/19/2018 Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co-located FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) in Monterey, California, February 18-21, 2019.
12/19/2018 A research study on low noise and high-performance transistors led by Suprem Das, assistant professor of industrial and manufacturing systems engineering, in collaboration with researchers at Purdue University, was recently published by Physical Review Applied.
12/19/2018 Synopsys, Inc. today announced that the Liberty Technical Advisory Board (LTAB) and Interconnect Modeling Technical Advisory Board (IMTAB) have ratified new modeling constructs to address timing and parasitic extraction challenges at process nodes down to two nanometers.
12/19/2018 The billings figure is 4.2 percent lower than the final October 2018 level of $2.03 billion, and is 5.3 percent lower than the November 2017 billings level of $2.05 billion.
12/18/2018 An international team of researchers has developed a technique that, for the first time, allows single-crystal hybrid perovskite materials to be integrated into electronics.
12/18/2018 Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.
12/17/2018 Using ultrasensitive magnetic probes, researchers unveil a surprising link between emergent magnetism and mechanical pressure in artificially engineered non-magnetic oxide heterostructures.
12/14/2018 MIT researchers have invented a way to fabricate nanoscale 3-D objects of nearly any shape. They can also pattern the objects with a variety of useful materials, including metals, quantum dots, and DNA.
12/13/2018 Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTekÂ’s power management integrated circuit (PMIC) for smartphone applications.
12/13/2018 ClassOne Technology, global supplier of wet processing equipment for <200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany.
12/13/2018 Micron Technology, Inc., a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference design.
