03/19/2007 March 19, 2007 - The Taipei High Administrative Court has ruled in favor of Richard Chang, CEO of Chinese chipmaker SMIC, who was fined by the Ministry of Economic Affairs Investment Commission for allegedly violating bans on mainland-bound chipmaking investments.
03/19/2007 March 17, 2007 -- /PRWeb/ -- Arlington, VA -- The nominees for the 2007 Life Science Industry Awards have been announced, and 559 life science suppliers were nominated across 20 Award categories.
03/19/2007 March 17, 2007 -- /FDA/ -- The Food and Drug Administration (FDA) has been informed that Menu Foods, Inc., a private-label pet food manufacturer based in Statesville, Ontario, Canada, is recalling all its "cuts and gravy" style dog and cat food produced at its facility in Emporia, Kansas between December 3, 2006 and March 6, 2007.
03/19/2007 Virtus Advanced Sensors, a US company commercializing MEMS multi-axis inertial sensors, established a subsidiary in Tokyo and signed a collaboration agreement with USC, the largest trading company of Sony Corp. The companies will work together on design-in projects for USC customers in Japan and Asia, while USC makes a direct investment in Virtus.
03/19/2007 March 15, 2007 -- /BUSINESS WIRE/ -- SUNNYVALE, Calif. -- SELA, a leading global supplier of engineering and failure analysis tools for the semiconductor industry, has set its production schedule for the Xact, the first STEM/TEM sample preparation system using the disruptive new AIMTM (Adaptive Ion Milling) technology.
03/19/2007 March 19, 2007 - The firm Research and Markets has released a new market study that compiles European fab stats. The company found that Europe accounts for more than 280 production and research fabs active in one or more of the investigated technology fields, including ICs and MEMS. Also, Europe employs about 65,000 people related to fab manufacturing activity.
03/16/2007 March 15, 2007 -- /PRWeb/ -- Colorado Springs, CO -- Global Fab Surplus Semiconductor Equipment (GFAB) LLC, a leading provider of used semiconductor equipment, complete wafer fabs, subsystems, spares and service, are pleased to announce their business partnership with ascent'tec Europe B.V., a premier source of Chemical Mechanical Planarization equipment, spares and service in Europe.
03/16/2007 By Jia-Sheng Huang, Rongsheng Miao, Hanh Lu, Charlie Wang, Chris Helms, and Hamdi Demerci, Emcore
To design device performance and reliability accurately, knowledge of junction temperature is important. One common method used to estimate heating is by wavelength shift, measured at a room temperature, free-standing condition. The deduced junction temperature from the wavelength method is often used as a reference; however, such approach may lead to inaccurate life test estimates.
03/16/2007 A thin, planar superconducting heat spreader, IsoSkin provides thermal conductivities as high as 10,000 W/mK. The product is available in thicknesses down to 500 µm. It can replace the outer shell of electronic components, and is said to eliminate the need for heatsinks or other cooling devices in some applications.
03/16/2007 The APR-5000-XLS array package rework system incorporates six convection underboard heaters, an upper nozzle, and revised heating algorithms for reworking lead-free BGAs without damaging ICs.
03/16/2007 March 14, 2007 -- /IEST/ -- ROLLING MEADOWS, IL -- Technical papers on the Mars Rover and Hubble Space Telescope projects will be available when the April 2007 issue of the Journal of the IEST, official technical publication of the Institute of Environmental Sciences and Technology, goes online.
03/16/2007 North America-based semiconductor-equipment manufactures posted a 1.05 book-to-bill ratio in February 2007, with $1.65B in orders received and $1.58B billings worldwide. The book-to-bill, published by SEMI, has risen incrementally since October 2006, and remained above parity since December.
03/16/2007 Crossbow Technology announced the formation a new business unit focused on commercializing the company's MEMS-based wireless technology. The business will be led by former Intel executive Michael Dierks.
03/16/2007 March 16, 2007 - Bede X-ray Metrology has announced that SEMATECH will use a Bede x-ray metrology system to evaluate novel semiconductor materials needed for the 45nm and 32nm technology nodes and beyond.
03/16/2007 March 16, 2007 - North American-based manufacturers of semiconductor equipment posted $1.65 billion in orders in February 2007 (three-month average basis) and a book-to-bill ratio of 1.05 according to SEMI. The bookings figure is about one percent under the final January 2007 level of $1.67 billion and about 28 percent above the $1.29 billion in orders posted in February 2006.
03/15/2007 Asymtek, a Nordson company, released an automated dispensing system, the DispenseMate D583/585, based on the company's DispenseMate D-550 benchtop series. It targets dispensing applications that require compact, benchtop equipment, such as batch productions, laboratories, new product development, and prototyping.
Virtus Advanced Sensors, a US company commercializing MEMS multi-axis inertial sensors, established a subsidiary in Tokyo and signed a collaboration agreement with USC, the largest trading company of Sony Corp. The companies will work together on design-in projects for USC customers in Japan and Asia, while USC makes a direct investment in Virtus.
Crossbow Technology announced the formation a new business unit focused on commercializing the company's MEMS-based wireless technology. The business will be led by former Intel executive Michael Dierks.