03/15/2007 March 15, 2007 - According to research reported by the Georgia Institute of Technology, the 3D shells of tiny ocean creatures known as diatoms could provide the foundation for novel electronic devices.
The growing consumer appetite for large-area flat-panel displays (FPDs) -- particularly for TVs, but also for notebook computers and PC monitors -- presents enormous opportunities for FPD makers. But to meet demand they must first overcome some major technological and manufacturing hurdles, according to Jyh Chau Wang, VP of Taiwanese LCD supplier Chi Mei Optoelectronics, speaking at the recent Industry Strategy Symposium.
03/15/2007 March 15, 2007 - Luxtera Inc. has announced that it is the first company to use a standard SOI-CMOS fabrication process to develop an integrated long-wavelength photodetection capability by strategically adding pure germanium around optical waveguides.
03/15/2007 March 15, 2007 - IC Insights today released its ranking of the Top 25 worldwide semiconductor (ICs and OSDs --optoelectronics, sensors, and discretes) sales leaders for 2006. Although six of the 25 suppliers posted revenue spikes of greater than 35% in 2006, about one-third of the companies (eight) registered below-average sales growth (i.e., less than 9%) last year.
03/15/2007 Steinmeyer, Inc. has released a new high-precision linear stage, the MT 84-25-PM, geared to nanotechnology, metrology, biomedical miniature robotics, and medical industry applications.
03/15/2007 March 15, 2007 - Chipmakers applying for building 300mm wafer fabs on the Hsinchu Science Park (HSP) were notified last month by the park administration to hold a joint groundbreaking ceremony in May to mark the beginning of the construction, according to CENS, the Taiwan Economic News.
03/14/2007 March 14, 2007 - Elpida Memory Inc., a Japanese supplier of dynamic random access memory (DRAM), has entered into a multi-year partnership with IMEC, an independent nanoelectronics research center, to perform R&D for beyond 50nm DRAM process generations, said IMEC today.
03/14/2007 By John P. Henderson, CH2M HILL, Spartanburg, SC; Ronald J. Lorefice, IBM, East Fishkill, NY
This article addresses the architectural aspects of the design and construction of IBM's B323 annex, which was designed in 2003 and built in 2004. The design intent was to continue the existing material palette, to unify the two buildings into one, and to insure that new ideas and concepts were implemented into B323A, allowing the new annex to stand on its own merits.
03/14/2007 By Joel McGrath, Rio Design Automation Inc.
No one disputes the predictions and analysis that package costs are on the rise. However, minimizing layer count results in increased routing complexity on the package, and the majority of routing must take place on a single layer with little flexibility. This complexity, along with price sensitivity, is driving an emerging chip design methodology known as package-aware chip design.
03/14/2007 Ramtron boasts the highest density FRAM device available with the launch of its FM22L16. Based on a 130 nm CMOS manufacturing process, it promises quadruple the capacity of previous memory chips.
03/14/2007 Zuken joined the ADEPT-SiP project, a collaboration between industry partners, academia, and the U.K. government to develop a design and manufacturing methodology for system-in-package (SiP) technology.
03/14/2007 March 14, 2007 - Packaging equipment developer NEXX Systems has entered into an ongoing joint development program (JDP) with Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). The JDP represents a collaborative effort to assess, develop, optimize, manufacture, and/or market electrodeposition processes using NEXX's Stratus system, including through silicon vias (TSV), wafer-level chip-scale packaging, and redistribution layers.
03/14/2007 March 14, 2007 - Hiwin Technologies Corp., Taiwan's largest manufacturer of linear mechanical transmission components, has made a breakthrough in the field of robots, the Taiwan Economic News (CENS) reports.
03/13/2007 NANOIDENT Technologies AG opened its first manufacturing facility for printed semiconductor-based optoelectronic sensors, NANOIDENT ORGANIC FAB, in Linz. The production facility uses no toxic materials, according to the company, and supports prototype through high-volume production.
03/13/2007 March 13, 2007 -- /BUSINESS WIRE/ -- LINZ, Austria -- NANOIDENT Technologies AG, the world leader in printed semiconductor-based optoelectronic sensors, today announced it has opened the world's first manufacturing facility for the delivery of printed semiconductor-based optoelectronics.
03/13/2007 Endicott Interconnect Technologies, Inc. (EI), appointed Rajinder Rai as VP of R&D. Rai will assume immediate responsibility for assembling a development team to implement advanced processes and manufacturing, and will manage resources and support functions for the company's current and future R&D projects. He will also monitor and respond to state and federal program agencies for R&D opportunities.
03/13/2007 March 7, 2007 -- /IEST/ -- ROLLING MEADOWS, IL -- The Institute of Environmental Sciences and Technology (IEST) announces the publication of the first document produced by the International Organization for Standardization Technical Committee (ISO/TC) 142, Cleaning equipment for air and other gases.
Steinmeyer, Inc. has released a new high-precision linear stage, the MT 84-25-PM, geared to nanotechnology, metrology, biomedical miniature robotics, and medical industry applications.
Ramtron boasts the highest density FRAM device available with the launch of its FM22L16. Based on a 130 nm CMOS manufacturing process, it promises quadruple the capacity of previous memory chips.