09/08/2017 UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks.
09/08/2017 Researchers from the National University of Singapore (NUS) have established new findings on the properties of two-dimensional molybdenum disulfide (MoS2), a widely studied semiconductor of the future.
09/07/2017 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology.
09/07/2017 Kulicke & Soffa Industries, Inc. announced today its collaboration agreement with Kinik Company, to provide comprehensive dicing blades solutions.
09/07/2017 SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced that UltraSoC will provide debug and trace technology for the SiFive Freedom platform, based on the RISC-V open source processor specification as part of the DesignShare initiative.
09/07/2017 Healthcare is facing one of its major turning points in decades. After penetrating the consumer market, the digital revolution and its related IoT concept is rapidly changing health models.
09/06/2017 The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.
09/06/2017 Researchers have shown that defects in the molecular structure of perovskites - a material which could revolutionise the solar cell industry - can be "healed" by exposing it to light and just the right amount of humidity.
09/06/2017 Researchers examining the flow of electricity through semiconductors have uncovered another reason these materials seem to lose their ability to carry a charge as they become more densely "doped." Their results, which may help engineers design faster semiconductors in the future, are published online in the journal ACS Nano.
09/06/2017 Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.
09/05/2017 Flex Logix Technologies, Inc., the supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC's Open Innovation Platform.
09/05/2017 The modern world relies on portable electronic devices such as smartphones, tablets, laptops, cameras or camcorders. Many of these devices are powered by lithium-ion batteries, which could be smaller, lighter, safer and more efficient if the liquid electrolytes they contain were replaced by solids. A promising candidate for a solid-state electrolyte is a new class of materials based on lithium compounds, presented by physicists from Switzerland and Poland.
09/05/2017 FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.
09/05/2017 Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).
