03/01/2007 A team of researchers at Johns Hopkins University has demonstrated a new way to slip drug-bearing nanoparticles through the body’s protective shields of mucus while surprising even themselves with just how big these microscopic delivery vehicles can be constructed.
03/01/2007 SEOUL, South Korea- Synova received tool orders from a Korea-based organic LED (OLED) manufacturer and a U.S.-based semiconductor manufacturer’s Korea facility.
03/01/2007 A fan filter unit (FFU) consists of a small blower with a matched fan, an optional digital or solid-state speed controller, and a HEPA/ULPA filter, all enclosed in an aluminum or stainless-steel box.
03/01/2007 Kelly Freeman, a physics major at Texas State University in San Marcos, wanted to explore her employment options and boost her chances of finding a job.
03/01/2007 It wasn’t too long ago that deciding where to locate your scanning probe microscope was a simple endeavor: put it in the basement where the ambient vibration is minimized.
03/01/2007 anufacturers and OEMs need a package-level cooling solution that provides cooling in close proximity to the chip, to cool hot spots and smooth out non-uniform power dissipation.
03/01/2007 t the 2007 Consumer Electronics Show (CES), convergence, or the merging of PCs, TVs, cell phones, and other devices that enable access to diverse and growing content, was a key theme.
03/01/2007 The need for system-size reduction, high-performance interconnects, and heterogeneous integration of true system-on-chip (SoC) is driving the packaging world towards 3-D chip integration.
03/01/2007 Attendees at the 8th Annual Burn-in Test and Sockets Workshop (BiTS), March 11-14 in Mesa, AZ, are invited to Advanced Packaging’s Meet the Press, March 12th at 5pm to learn about general market trends in the sockets industry.
03/01/2007 SINGAPORE - In a bid for the mobile handset market, STATS ChipPAC developed a method of stacking 3-D packages, creating a package-on-package (PoP) with up to seven stacked die.
03/01/2007 This issue of Advanced Packaging stands out for me because I had a chance to get to know more about practical issues that revolve around sockets.
