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New ways to improve job performance through IEST at ESTECH 2007

02/23/2007  February 22, 2007 -- /IEST/ -- ROLLING MEADOWS, IL -- The Institute of Environmental Sciences and Technology (IEST) announces ESTECH 2007, its 53rd annual technical meeting and exposition, will be held April 29-May 2, 2007 at the Indian Lakes Resort in Bloomingdale, Illinois (northwest suburban Chicago).

Donaldson expands global distribution capacity

02/23/2007  February 21, 2007 -- MINNEAPOLIS, MN -- Donaldson Company (NYSE:DCI), a leading, worldwide manufacturer of filtration systems and parts, announces the opening of four distribution centers.

ISO/FDIS 14644-6 Vocabulary available from IEST

02/23/2007  February 21, 2007 -- /IEST/ -- ROLLING MEADOWS, IL -- The final draft International Standard (FDIS) version of International Organization for Standardization (ISO) Standard 14644-6 Cleanrooms and controlled environments, Part 6: Vocabulary is now available through the Institute of Environmental Sciences and Technology (IEST).

SICAS: Capacity adds still outpaced output in 4Q

02/22/2007  February 22, 2007 - The latest data from Semiconductor International Capacity Statistics (SICAS) shows that actual wafer starts have slowed behind rising capacity additions, causing utilization rates to decelerate further below the 90% mark historically used to signal new capacity investments.

Dynaloy, BASF Expand WLP Partnership

02/22/2007  Dynaloy LLC and BASF AG entered into an expanded sales and distribution agreement for strippers and cleaners used in wafer-level packaging (WLP) and bumping processes. BASF expects the partnership to broaden its back-end semiconductor market penetration, while Dynaloy is targeting Asian and European markets.

New Agilent beamsplitters promise precision

02/22/2007  Agilent Technologies Inc. announced a new line of thin-film beamsplitters, designed to provide precision control for nanotechnology measurement and other applications. The units are available in multiple geometries.

Tylerstone changes name to nCoat, focus to nano-formulated coatings

02/22/2007  Tylerstone changes name to nCoat, focus to nano-formulated coatings

Andigilog Completes Series B

02/22/2007  Andigilog received $18 million in a series B financing round, with four new investors and three returning venture capital companies. The thermal management solutions company will use this funding to penetrate for desktop, notebook, and cooling fan markets; and to extend its product portfolio.

Blaze, Aprio tie up in DFM merger

02/21/2007  February 21, 2007 - Staking their claim to the mantle of tops in "electrical DFM," Blaze DFM and Aprio Technologies have announced a merger that they say will create "the industry's only comprehensive electrical DFM solution."

Donbgu merging foundry, chemicals group into "biosemiconductor enterprise"

02/21/2007  February 21, 2007 - The Dongbu group says it will merge its foundry business, Dongbu Electronics, with Dongbu Hannong Chemicals to create a "biosemiconductor enterprise" to provide foundry services along with advanced materials targeting bioengineering, nanotechnology and semiconductor processing.

New resist strip technology slashes sulfuric acid, hydrogen peroxide use

02/21/2007  February 21, 2007 - Toshiba Corp., Shibaura Mechatronics Corp., and Chlorine Engineers Corp. Ltd. have devised a new semiconductor resist strip technology that utilizes electrolyzed sulfuric acid to reduce the volume of sulfuric acid used in the process by 70%, and entirely eliminate the need for hydrogen peroxide.

FEI introduces tool for nanoprototyping and nanoanalysis

02/21/2007  FEI says its new Quanta 3D FEG is the first high-resolution, low-vacuum SEM/FIB (DualBeam) for 3D material characterization, failure analysis, and process control.

Update on salmonella outbreak and Peter Pan Peanut Butter and Great Value Peanut Butter

02/21/2007  February 16, 2007 -- /FDA News/ -- On February 14, 2007, FDA advised consumers not to eat any Peter Pan peanut butter purchased since May 2006 and not to eat Great Value peanut butter with a product code beginning with "2111" purchased since May 2006 because of risk of contamination with Salmonella Tennessee.

Recall of cantaloupes due to potential health concerns

02/21/2007  February 16, 2007 -- /FDA News/ -- Westlake Village, CA -- Dole Fresh Fruit Company announced the recall of cantaloupes in the Eastern U.S. and Quebec due to potential health concerns. Some cantaloupes packed on January 25, 26 and 27, 2007 by an independent, third-party grower in Costa Rica have tested positive for Salmonella.

FDA warns consumers not to use certain jars of Earth's Best: "Organic 2 Apple Peach Barley Wholesome Breakfast Baby Food"

02/21/2007  February 16, 2007 -- /FDA News/ -- The Food and Drug Administration (FDA) is warning consumers not to use certain jars of Earth's Best Organic 2 Apple Peach Barley Wholesome Breakfast baby food because of the risk of contamination with Clostridium botulinum, a bacterium which can cause botulism, a life-threatening illness or death.

Agilent Names VP Corporate Development

02/21/2007  Shiela Robertson will succeed John Eaton as VP of corporate development at Agilent Technologies Inc. Eaton will retire after 23 years with Agilent and Hewlett-Packard (HP). Robertson's post as operational CFO, electronic measurement group (EMG), will be filled by Robert Cantrell.

Carbon nanotubes provide critical link to block HIV

02/21/2007  Stanford University researchers are using carbon nanotubes to transport gene therapy drugs into T-cells. The effect is prevention of the dreaded HIV virus from entering cells in vitro.

Engineer-level User-interface Software

02/20/2007  JPSAControls32 system-control software provides control for all system devices and software components for system setup and programming. Windows-based and English-language, the software offers features such as a system-configuration editor for editing settings, and CAD file translation capability for .dxf files, allowing automated programming of complex designs. The product integrates motion devices, including laser-fire commands, with a dual-camera system.

Flip Chip Bonding and Underfill System

02/20/2007  The FS2500N meets requirements for high-density interconnects (HDI) with reportedly increased speed and accuracy over previous generations. Its flip chip packing system performs alignment and bonding at 1.7 sec. per chip excluding process time, with accuracies of less than 2 µm, and the bonding system suits various materials with low voiding.

AOI for MEMS

02/20/2007  The Falcon 600 automated optical inspection (AOI) system targets MEMS and other special applications for the semiconductor manufacturing and packaging industries. The model targets applications that require special handling and inspection capabilities, such as optoelectronic devices, MEMS, wafer-level packaging (WLP), and glass substrates.