02/16/2007 February 16, 2007 - The Fabless Semiconductor Association (FSA) has released the first tool in a planned "ecosystem" of IP deliverables that aims to address pain points of IP integration by enabling more effective communication between IP vendors, fabless companies, IDMs, and foundries.
02/16/2007 February 16, 2007 - Researchers at the U. of California-Riverside have designed the building blocks for a memory device that uses telescoping binary or three-stage carbon nanotubes as high-speed, low-power microswitches.
02/16/2007 February 16, 2007 - North American suppliers of semiconductor manufacturing equipment enjoyed a double-digit boost in demand for their tools to kickstart the year, and sales picked up as well, mainly due to capacity investments from memory firms, according to the latest data from SEMI.
02/16/2007 Those working with sterling silver have tried various methods to combat tarnishing effects, including several surface treatment methods. Many processes based on lacquers are widely in use—but lacquers don't adhere well to silver, and the lacquer layers are usually visible.
02/15/2007 Honeywell Electronic Materials will expand its Spokane, WA, R&D center for advanced packaging materials, investing more than $1 million and adding about 85 pieces of equipment. The company plans to develop thermal management, electrical interconnect, and burn-in materials. The construction project is expected to finish by the end of 2007.
02/15/2007 Micron Technology, Inc., will incorporate its next-generation 1Gb mobile DRAM into "bundle" packages with the company's NAND flash memory. The multichip packages (MCPs) will target high-end mobile phone applications.
02/15/2007 The development of a highly sensitive biochip based on silicon nanowire technology promises to advance the detection and analysis of RNA and DNA, which is central to many life sciences endeavors, ranging from uncovering and diagnosing disease to the discovery and screening of new drugs.
02/15/2007 As the first commercial flexible electronics reach consumers, significant manufacturing and technological obstacles remain for the potential multibillion-dollar market. This was one of the key themes at last week's Flexible Display & Microelectronics Conference.
02/14/2007 February 14, 2007 - Applied Materials Inc. delivered fiscal 1Q07 results that were down sequentially as expected. But an anticipated recovery by the foundry sector and sustained strength in NAND flash could help the company exceed overall projected industry capex growth, executives said in a conference call discussing the numbers.
02/14/2007 The commercial use of MEMS and nanotechnology ranges from display, gyro-sensor, and ink-jet printing to smart-RFID, RF-MEMS, and wireless-sensing sectors; this technology expansion is creating competitive and converging applications for MEMS devices, according to Bourne Research. The research firm released seven market briefs outlining the dynamics of MEMS and nanotechnology in emerging applications.
02/14/2007 After five years of intensive nanotechnology R&D, Belgian company TopChim nv is introducing its NanoTope material in coating pigments for the paper industry. TopChim signed a contract with Mondi Business Paper for exclusive development of neox paper, which Mondi says attracted "a great deal of attention" at Paperworld 2007 in Frankfurt, Germany.
02/14/2007 NanoInk a company specializing in nanometer-scale manufacturing and applications development for the life sciences and semiconductor industries, has exclusively licensed intellectual property from Arrowhead Research Corporation a publicly-traded nanotechnology company commercializing new technologies in the life sciences, electronics, and energy arenas.
02/13/2007 Applied says the beamline implant business won't return enough profits to justify future R&D investments, but the decision may also be just as much about the dynamics of a fiercely competitive market segment -- and possibly another implant card up the company's sleeve.
02/13/2007 February 13, 2007 - Renesas Technology Corp. and Matsushita Electric Industrial Co. Ltd. say they have developed a technique that achieves stable operation with 45nm bulk CMOS, instead of silicon-on-insulator (SOI), for SRAM that can be embedded in system-on-a-chip (SoC) devices and microprocessors.
02/13/2007 February 9, 2007 -- /MARKET WIRE/ -- SANTA CLARA, CA and OAKLAND, NJ -- LumaSense Technologies, Inc., a leading provider of sensing solutions, and Mikron Infrared (NASDAQ: MIKR) today announced LumaSense Technologies will acquire Mikron Infrared, a leader in the field of infrared non-contact temperature measurement and thermal imaging since 1969.
02/13/2007 February 12, 2007 -- /BOC EDWARDS/ -- WILMINGTON, MASS -- BOC Edwards, a leading supplier of vacuum, abatement, chemical management equipment and services to the world's semiconductor OEMs and fabs, announced today that it has donated one DFP 200 Dense Fluid Processor High-precision Advanced Wafer Chamber System and associated pumps, valves and other components to the MassNanoTech Institute.
02/13/2007 February 7, 2007 -- /Micralyne/ -- Edmonton, Alberta -- Micralyne Inc., a world leading independent MEMS microfabrication company, has broken ground on a facility expansion that will increase its manufacturing capacity to accommodate its growing customer base.
02/13/2007 February 9, 2007 -- /PRNewswire/ -- GARNER, N.C. -- Best Lab Deals, Inc. recently received over $6 million of ThermoFisher Overstock, Demo and Scratch & Dent inventory.
02/13/2007 February 12, 2007 -- /PRNewswire-FirstCall/ -- LEHIGH VALLEY, Pa. -- Air Products (NYSE:APD) today announced it has broken ground on the first phase of its nitrogen trifluoride (NF3) plant in Ulsan, Korea.