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ASE K7 receives Green Factory Label

09/01/2017  Advanced Semiconductor Engineering, Inc, a semiconductor assembly and test service provider, announced that its K7 manufacturing facility in Kaohsiung has received the Green Factory Label from the Industrial Development Bureau, Ministry of Economic Affairs, Taiwan.

Update on the sale of Toshiba Memory Corporation

09/01/2017  There have been media reports speculating that Toshiba will make a decision on Aug 31 at ToshibaÂ’s Board of Directors meeting.

DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

09/01/2017  A dozen performer teams with DARPAÂ’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

SonyÂ’s stacked image sensor

09/01/2017  It has been nearly a decade since Toshiba announced the use of backside TSVÂ’s to miniaturize CMOS image sensors.

Equipment forecast: $49.4 billion

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

The ConFab 2018 will be held May 20-23

09/01/2017  The ConFab 2018, to be held May 20-23 in Las Vegas at THE COSMOPOLITAN of Las Vegas, will take a close look at the new applications driving the semiconductor industry, the technology that will be required at the device and process level to meet new demands, and – perhaps most importantly – the kind of strategic collaboration that will be required.

Insect eyes inspire new solar cell design from Stanford

09/01/2017  Packing tiny solar cells together, like micro-lenses in the compound eye of an insect, could pave the way to a new generation of advanced photovoltaics, say Stanford University scientists.

TV market: Quantum dots reinforce LCD positioning, faced with the OLED solutions

08/31/2017  How will the competitive landscape evolve, especially with OLED solutions?

New device could turn heat energy into a viable fuel source

08/31/2017  A new device being developed by Washington State University physicist Yi Gu could one day turn the heat generated by a wide array of electronics into a usable fuel source.

STMicroelectronics boosts its ecosystem with partner program that connects customers with qualified third parties

08/31/2017  STMicroelectronics has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

Leti launches emulator service to boost ROI and speed time to market for European chipmakers

08/31/2017  Leti, a technology research institute of CEA Tech, and Mentor, a Siemens business, today announced Leti will provide access to the Mentor Veloce emulator to SMEs and startups and will introduce emulation technology to global companies beginning Q3 2017.

Physicists learn how to create nanopores of specified size in graphene

08/30/2017  A group of international physicists, jointly with NUST MISIS researchers, have conducted a series of experiments on graphene bombardment by swift heavy ions.

Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

08/30/2017  Qualcomm Incorporated and Himax Technologies, Inc. today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.

Acting like a muscle, nano-sized device lifts 165 times its own weight

08/30/2017  Rutgers materials scientists discover powerful effect that could benefit robotics, aviation, medicine and other fields.

Silicon solves problems for next-generation battery technology

08/30/2017  Silicon - the second most abundant element in the earth's crust - shows great promise in Li-ion batteries, according to new research from the University of Eastern Finland. By replacing graphite anodes with silicon, it is possible to quadruple anode capacity.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

08/29/2017  Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

Automotive sensing: A mature yet highly dynamic market

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

Panel makers forecast to maintain high fab utilization rates in Q3

08/29/2017  The overall utilization rate of display panel fabrication (fab) plants is expected to remain high in the third quarter of 2017, recording similar levels for the fifth consecutive quarter.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.