Featured Content

01/01/2007  MEMS components have been in projectors since 1996 and in TVs since 2002, but the cell phone market is the latest, greatest frontier

01/01/2007  A recent spate of spectacular MEMS product developments aimed at large mainstream applications has kindled debate about MEMS’ suitability for high-volume CMOS manufacturing.

01/01/2007  Whether it’s a maker of tools, filters, spaces, air quality monitors, or manufacturer of the wafers themselves, each member of the industry has a role to play in keeping the production environment clean.

01/01/2007  New array suggests throughput could eventually meet commercial needs

01/01/2007  When research scientist Bruce E. Torbett is isolating stem cells from blood in his laboratory at The Scripps Research Institute’s Department of Molecular and Experimental Medicine, he relies on a hefty device that costs about $30,000.

01/01/2007  Albany Nanotech put another notch in its belt when it qualified its 65nm semiconductor fabrication line in September.

01/01/2007  The vast majority of microdevices are built out of silicon using photolithographic processes.

01/01/2007  The silicon industry has achieved stunning advances over its nearly 50 year history.

01/01/2007  For disk-drive makers, contamination control is part of fighting the law, Hwang’s law to be precise.

01/01/2007  News snippets from the world of contamination control.

01/01/2007  Statistics are the essence of cleanroom air cleanliness classification, yet the reasons behind this are often not well understood or appreciated.

01/01/2007  One of the keys to successful wafer bumping is the removal of surface oxides on the deposited solder during reflow, usually done by using organic fluxes.

01/01/2007  Each month, CleanRooms brings you a collection of the latest product innovations in the contamination-control industry.

01/01/2007  Technology shifts in consumer electronics present manufacturers with a laundry list of challenges.

01/01/2007  Many of today’s advanced packages use solder ball contact arrays to make package-to-board or package-to-package level 2 electrical connections.

01/01/2007  he use of light signals to connect different chips within a computer or different parts within a chip has attracted lots of attention due to the huge bandwidth provided by optics.

01/01/2007  Continuous innovation is key to future survival and growth of businesses operating in increasingly competitive global markets.

01/01/2007  1. Touring the NEXX System facilities are, from left to right, Gail Flower, editor-in-chief; Stan Piekos, VP finance; Meredith Courtemanche, assistant editor; Arthur Keigler, VP technology; Diane Donnelly, AP national sales manager; Dick Post, CEO; and Françoise von Trapp, managing editor.

01/01/2007  Playing golf has taught me a bit about work under pressure. I wouldn’t say that my golf game is bad, but if I grew tomatoes, they would probably come up sliced.

01/01/2007  Increasing miniaturization and circuit density is an ongoing trend in electronics.