01/01/2007 Perhaps for the first time in electronics, packaging has come into its own. As you read this forecast for 2007, you will notice a new attitude filled with confidence and enthusiasm.
01/01/2007 PLANO, TX - A merger between CV Inc. Business Solutions, FIB-X, Microtech Analytical Labs LP (MAL), and Fast Semiconductor, Inc. (FAST Semi), has created a full-scale prototyping house for chip-scale, flip chip, BGA, and QFN packages, with bumping and wire-bonding, assembly, failure analysis, design debug, and other packaging services.
01/01/2007 BINGHAMTON, NY and ATLANTA - The Packaging Research Center (PRC) at the Georgia Institute of Technology (Georgia Tech) in Atlanta is partnering with Binghamton University, NY, to develop and promote a possible industry consortium addressing thermal interface materials (TIMs).
01/01/2007 SAN JOSE, CA - The U.S. Display Consortium (USDC) board of directors will launch an initiative to promote flexible, printed, and organic (FPO) electronics, providing services to industry, academia, and government sectors with the aim of developing and expanding the FPO electronics sector and drafting a pertinent technology roadmap.
01/01/2007 LOS ANGELES - IPC Printed Circuits Expo/APEX/Designers Summit, February 18-22 in Los Angeles, will host the 50th anniversary celebration of the IPC - Association Connecting Electronic Industries, as well as various other celebratory and informative events.
01/01/2007 Datacon Technology GmbH named H. Fillunger & Co., Pvt. Ltd., sales representative in India. H. Fillunger, headquartered in Pune, India, also operates in Mumbai, an industrial center; Bangalore; and New Delhi, the capital. Datacon noted that the country’s market for electronics manufacturing equipment is rapidly expanding.
01/01/2007 CAMBRIDGE, U.K. - Reporting on the usage and volume of radio-frequency identification (RFID) tags, IDTechEx’s “RFID - A Tale of Four Continents,” examines data from North America, East Asia, Europe, and Australasia. IDTechEx found North America to be the largest RFID market in value, tag volume, and case studies, with the U.S. being the primary driver.
01/01/2007 ENDICOTT, NY - Warren Dannelly became director of sales, global accounts, for Endicott Interconnect Technologies, Inc., reporting to Michael Hills, senior VP of account services.
01/01/2007 PARIS - Souriau S.A.S., controlled by Sagard Private Equity Partners, signed a binding agreement to acquire U.S. operations of Pacific Aerospace & Electronics Inc. (PA&E).
01/01/2007 GOLDEN, CO - Ceramics supplier and component manufacturer CoorsTek, acquired Gaiser Tool Company (Ventura, CA), a precision-tooling manufacturer of ceramic capillaries for high-reliability wire bonds.
01/01/2007 CAMBRIDGE, U.K. - Plastic Logic, which produces plastic substrates, garnered funding from a variety of equity sources to open a factory for commercial production of plastic electronics, specifically, the flexible active-matrix display modules of electronic readers.
12/22/2006 NanoSensors Inc., a Santa Clara, Calif., nanotechnology development company that develops instruments and sensors to detect explosives, chemical and biological agents, announced that it has engaged a third-party contractor to manufacture units of a test version of its biosensor product that will be used for third party field testing.
12/22/2006 Tegal Corp., a San Jose, Calif., designer and manufacturer of plasma etch and deposition systems, announced that it had received an order for an 6500 Advanced Etch cluster tool from Skyworks Solutions Inc.
12/21/2006 Egide, a European group manufacturing of hermetic packages for sensitive electronic components, has signed an agreement to supply hermetic packages for Textron System's military Sensor Fuzed Weapon Program (SFW).
12/20/2006 North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 in November, up slightly from October's 0.95. Bookings averaged $1.45B and billings reached $1.49B.
12/19/2006 The 8th annual Burn-in and Test Socket (BiTS) Workshop — March 11 – 14, 2007 in the Hilton Phoenix East of Mesa, AZ — issued an advance program with details on tutorials, keynotes, and presentations. BiTS EXPO, which runs concurrent with the workshop, will host about 40 socket and related companies.
12/19/2006 Developed for IC chip manufacturing markets to address probe contamination challenges during test, the SnoScrub wafer-cleaning product uses non-contact CO2-composite spray for adjustable (soft-to-hard cryoparticles), microscopic scouring called cryochemical ablation. This technology cleans wafer probes and high-speed test sockets, removing resistive buildup such as aluminum oxides and human contaminants.
Read our predictions for the year ahead, a review of the aerospace market, the 2006 MEMS industry report card and more.
Plus a report on how 2-year colleges are training the nano workforce of the future, MEMS-based energy monitoring, and how microfluidics solved the spinach scare.