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FUJIFILM Dimatix ships 5,000th materials cartridge

11/20/2006  FUJIFILM Dimatix Inc. of Santa Clara, Calif., announced it has shipped more than 5,000 Dimatix Materials Cartridges to customers in the first year of production of its Dimatix Materials Printer (DMP) systems.

Raymor announces major expansion of thermal spray coating production capacity

11/20/2006  Raymor Industries Inc., a developer and producer of single-walled carbon nanotubes, nanomaterials and advanced materials, announced that its wholly-owned subsidiary, AP&C Advanced Powders and Coatings, is currently expanding its thermal spray coating production capacity.

AMAT invests in solar wafer maker Solaicx

11/20/2006  November 20, 2006 - Furthering its newfound interests in the high-growth solar market, Applied Materials Inc. says it has invested $3.0 million in Solaicx, a privately held manufacturer of single-crystal silicon wafers for the solar photovoltaic (PV) industry. The firm plans to use the investment to open a second manufacturing site in the US by next year.

Report: MEMC selling out Taiwan silicon subcons

11/20/2006  November 20, 2006 - Flush with new business from solar-cell customers in Asia, MEMC Electronic Materials Inc. has anxiously approached two Taiwanese manufacturers to help grow and slice the silicon ingots, according to the Taiwan Economic News.

Altera and White Partner to Provide Mil/Aero Packaging Options

11/20/2006  Altera Corporation and White Electronics Design Corp. announced a partnership that will provide a variety of FPGA package options to the military and aerospace market. The companies say this is the first cooperative packaging agreement of its kind in the programmable logic industry.

UMC touts working 45nm SRAMs

11/20/2006  November 20, 2006 - Taiwanese foundry United Microelectronics Corp. (UMC) says it has produced functional 45nm SRAM chips at its Fab 12A, using immersion lithography for 12 critical layers, as well as ultrashallow junctions, mobility enhancement techniques, and a k=2.5 ultralow-k dieletric.

Tool demand slips in Oct. as customers digest capacity

11/17/2006  November 17, 2006 - Orders received by North American-based manufacturers of semiconductor equipment continued to slide from their peak in June (now 16% lower in just four months), as customers absorb capacity brought on with recent investments, according to new data from SEMI.

VLSI: Equipment demand slumps in October

11/17/2006  November 17, 2006 - Global demand for semiconductor manufacturing equipment fell as seasonally expected in October, but tool sales are still enjoying a brisk pace from a year ago. Meanwhile, chip orders continue to ramp up for holiday demand.

Report: SMIC fires back with TSMC suit

11/17/2006  November 17, 2006 - In the latest salvo between the industry's juggernaut foundry and an upstart rival, Chinese flagship foundry Semiconductor Manufacturing International Corp. (SMIC) has filed suit in the Beijing High Court against Taiwan Semiconductor Manufacturing Co. (TSMC), alleging unfair competitive practices, "breach of good faith," and "commercial defamation," according to an Associated Press report.

AMD, Fujitsu selling Spansion shares

11/17/2006  November 17, 2006 - AMD and Fujitsu, former JV owners of flash memory device maker Spansion Inc. and now two of the company's larger shareholders, are offering a total of 35 million shares of Spansion stock, about 27% of Spansion's total outstanding shares, for a total of $48.75 million.

Nordson Acquires Dage

11/17/2006  Nordson Corp., based in Westlake, OH, acquired Dage Holdings Ltd. of the U.K., subject to approval from the German Federal Cartel Office. The companies withheld purchasing terms.

Germany Companies Partner for Wire Bonders

11/17/2006  Finetech, headquartered in Berlin with a U.S. base in Tempe, AZ, and Technical Product Trade (TPT), located in Wessling, Germany, formed a technical partnership to offer wire bonders in North America. The bench-top systems, capable of wedge and ball bonding in one machine, will reach small production, prototyping, and R&D markets.

Photon Dynamics axing FPD inspection line

11/17/2006  November 17, 2006 - Days after posting significantly lower financial results and even weaker next-quarter projections, Photon Dynamics Inc., San Jose, CA, says it will discontinue its PanelMaster line of flat-panel display inspection products.

Fujitsu added as customer for Belgium firm's ESD tech

11/17/2006  November 17, 2006 - Sarnoff Europe says it has licensed its "TakeCharge" portfolio of on-chip electrostatic discharge protection technology to Fujitsu, for protecting the chipmaker's 65nm CMOS IC products.

NXP, TSMC up stakes in Singapore JV

11/17/2006  November 17, 2006 - As reported weeks ago, NXP Semiconductors (the former Philips chipmaking business) and partner TSMC have raised their ownership stakes in Systems on Silicon Manufacturing Co. Pte. Ltd. (SSMC), their joint venture chipmaking facility in Singapore.

Northeastern offers new nanomanufacturing fellowship

11/17/2006  The NSF Center for High-rate Nanomanufacturing at Northeastern University announced the Roger H. Grace fellowship in nanomanufacturing. Recipients will be awarded a renewable one-year position at the Center with stipend to work on a Center project or thrust area.

NanoSensors tests E. coli prototype

11/17/2006  NanoSensors Inc., a nanotechnology development company that develops instruments and sensors to detect explosives, chemical and biological agents announced that it has completed manufacturing the initial prototype of its planned product to detect E. coli. The product is based on the company's recently licensed nanoporous silicon-based biosensor technology to detect E. coli.

Heidelberg Instruments sells direct write litho system to Chinese firm

11/17/2006  Heidelberg Instruments GmbH, a Heidelberg, Germany-based supplier of direct write laser lithography systems, announced the order for an advanced MW800fs system by Shenzhen New Way Electronic Co. Ltd. of Shenzhen, China.

Vectron, Discera to collaborate on MEMS oscillators

11/17/2006  Discera Inc., a developer of MEMS resonator technology and provider of next-generation timing solutions, and Vectron International, a maker of frequency control and timing solutions, announced that they will work together on MEMS oscillators for electronics manufacturers.

SIA tweaks down chip sales forecast

11/16/2006  November 16, 2006 - The Semiconductor Industry Association (SIA) has slightly tweaked its outlook for chip sales for the next several years, seeing 9.4-10.6% growth through 2008, as the industry becomes even more tightly tied to consumer electronics demand.