Featured Content




Industry upswing: End of cycles?

08/14/2017  Semiconductor-related companies are trading at all-time highs, and record device shipments and revenues as well as equipment revenues are expected.

Everspin Announces 1-Gigabit MRAM

08/10/2017  Everspin Technologies, Inc. has begun sampling its new 1-Gigabit Spin Torque Magnetoresistive Random Access Memory (ST-MRAM) with lead customers.

Harnessing the properties of a remarkable 2-D material

08/10/2017  Researchers from A*STAR have developed a simple technique that could pave the way for its use in a wide range of new applications in energy storage, optoelectronic and flexible electronic devices

Global Memory Card Market to Exceed $9 billion by 2021

08/10/2017  The market for memory cards will reach $9.025 billion by 2021. ThatÂ’s up from $8.83 billion in 2016, a CAGR of approximately 0.45%.

Textured LED gives green light to Li-Fi

08/10/2017  Standard light-emitting diodes (LEDs) used for home lighting can now transmit data more rapidly between electronic devices.

Brain-mimicking nanomaterials for A.I. retina receive $7M research grant

08/09/2017  A future android brain like that of Star TrekÂ’s Commander Data might contain neuristors, multi-circuit components that emulate the firings of human neurons.

Samsung introduces far-reaching V-NAND memory solutions to tackle data processing and storage challenges

08/09/2017  Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

Landscapes give latitude to 2-D material designers

08/09/2017  Rice University, Oak Ridge scientists show growing atom-thin sheets on cones allows control of defects.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

Intel completes tender offer for Mobileye

08/08/2017  The combination of Intel and Mobileye will allow Mobileye's computer vision expertise (the "eyes") to complement Intel's high-performance computing and connectivity expertise (the "brains") to create automated driving solutions from cloud to car.

Toshiba announces next generation client SSD with 64-layer 3D Flash memory

08/08/2017  Toshiba America Electronic Components, Inc. (TAEC) announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH to deliver better transfer speeds and power efficiency.

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

Microsemi collaboration enables Mellanox and other industry leaders to deliver NVMe-oF architectures

08/08/2017  Microsemi's peer-to-peer memory technology facilitates large data streams to transfer between NVMe-oF applications with better throughput, latency and quality of service.

Opto-mechanical technique circumvents mechanical losses using the action of light

08/08/2017  A research collaboration between the University of Illinois at Urbana-Champaign, the National Institute of Standards and Technology, and the University of Maryland has revealed a new technique by which scattering of sound waves from disorder in a material can be suppressed on demand. All of this, can be simply achieved by illuminating with the appropriate color of laser light. The result, which is published in Nature Communications, could have a wide-ranging impact on sensors and communication systems.

Rinchem announces expansion of infrastructure in South Korea

08/07/2017  Rinchem recently announced the expansion of its chemical distribution center in Pyeongtaek, South Korea.

Cadence full-flow digital, signoff and Verification Suite optimized to support Arm Cortex-A75, Cortex-A55 CPUs and Arm Mali-G72 GPU

08/07/2017  Cadence delivered new 7nm-ready Rapid Adoption Kits (RAKs) for the Cortex-A75 and the Cortex-A55 CPUs, which include the DynamIQ Shared Unit (DSU) that provides a shared level 3 cache between the CPUs, and a 7nm-ready RAK for the Mali-G72 GPU.

NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Knowles appoints Dr. Cheryl Shavers to Board of Directors

08/04/2017  Knowles Corporation (NYSE: KN) today announced the appointment of Dr. Cheryl Shavers to the Board of Directors. Her appointment is effective August 1, 2017 and expands the Board to 9 directors, 8 of whom are independent.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.