10/01/2006 It was after production units started shipping that the contamination problems cropped up, says Kimberly Subrahmanyan, engineering director for the semiconductor link processing group at Electro Scientific Industries, Inc.
10/01/2006 SAN JOSE, CA - Further paving the way into the consumer optics arena, Tessera announced the first licensing agreement for their wafer-level image sensor packaging technology, Shellcase CF, to Flextronics International Ltd.
10/01/2006 The Trelleborg Group, developer of high-performance sealing and damping solutions, recently inaugurated its newly constructed manufacturing facility in Shanghai, China.
10/01/2006 Isola Group, SARL (Chandler, AZ; www.isola-group.), a designer, developer and manufacturer of high-performance base materials for the printed circuit board industry, recently announced extensive upgrades to its Singapore manufacturing facility.
10/01/2006 SANTA CLARA, CA - In an overview of its restructuring plan for the long-term future, Intel detailed reductions in workforce, merchandising expenses, capital, and materials.
10/01/2006 TEMPE, AZ - Motorola Labs and Arizona State University (ASU) have co-developed a coating process that allows chemical-detecting peptides to alert single-walled carbon nanotubes (SWNTs) to the presence of heavy-metal ions at the parts-per-trillion level.
10/01/2006 SHANGHAI, China - Verisilicon Holdings Co., Ltd., an ASIC design foundry, semiconductor library, and intellectual property (IP) provider, along with Semiconductor Manufacturing International Corporation (SMIC), will release a standard design platform (SDP) for 0.13-μm low-leakage processes.
10/01/2006 MOUNTAIN VIEW, CA - Actel Europe announced the addition of Rouzbeh Hosseinalikhani as a field applications engineer (FAE) to its Nordic and Baltic regions support staff.
10/01/2006 GOLDEN, CO - To build high-volume manufacturing facilities for its proprietary thin-film batteries, Infinite Power Solutions (IPS) attracted funding from existing and new corporate investors.
10/01/2006 With the July 2006 deadline for the European Union’s (EU’s) RoHS and WEEE directives past, it’s interesting to observe the long-term impact of lead-free implementation upon X-ray inspection.
10/01/2006 The removable solid-state storage (RS3) market posted strong growth in 2005, as consumer demand for flash cards and universal serial bus (USB) flash drives continued.
10/01/2006 As chip manufacturers drive to smaller device size follow the International Technology Roadmap for Semiconductors (ITRS), material challenges arise in every part of the manufacturing process.
