09/05/2006 By András Poppe and John Parry, Flomerics
The increased use of multi-chip, 3-D stacked-die packages makes developing accurate thermal characterization methodologies critical. A new thermal modeling method has been developed that involves performing thermal measurements over time at various locations throughout the package.
09/05/2006 At the third annual International Wafer-level Packaging Conference (IWLPC), a panel of industry analysts will discuss business and marketing issues in wafer-level and IC packaging.
09/05/2006 BPM Microsystems has added support for device serialization using FX4 and FX2 socket modules to its BPWin software. The integrated serialization feature became standard with the release of BPWin 4.62.
09/05/2006 September 5, 2006 - Taiwanese power supply maker Powercom Co. reportedly is contracting mainland foundry Semiconductor Manufacturing International Corp. (SMIC) to manufacture solar cells, with operation scheduled to begin in November
09/05/2006 A somewhat surprising consensus on future lithography came out of a panel of experts at SEMICON West, with discussions of potential lithography solutions for the 32nm half-pitch node including major problems facing developers of EUV and high-index fluid immersion lithography using 193nm lasers. The message from panelists was clear -- the industry will have to learn how to live with dual-patterning at least for awhile, while toolmakers seek ways to boost throughput limits.
09/05/2006 August 24, 2006 -- /BUSINESS WIRE/ -- STARKVILLE, Miss. -- SemiSouth Laboratories - a silicon carbide research and development company - announced today that it has completed the construction of its new silicon carbide (SiC) manufacturing facility and has completed a large portion of the installation of its manufacturing equipment.
09/05/2006 August 28, 2006 -- /Evergreen Engineering/ -- HILLSBORO, OR Evergreen Engineering has leased 8,133 square feet of office space at One Technology Center, 7431 NW Evergreen Parkway, Suite 210/220, Hillsboro, Oregon 97124.
09/05/2006 August 30, 2006 -- WILMINGTON, Del. -- DuPont today announced the introduction of its latest innovation, Hybrid Membrane Technology (HMT), a new offering for air and liquid filtration that is poised to fill the performance gap between traditional nonwovens and microporous films.
09/05/2006 August 30, 2006 -- /MARKET WIRE/ -- PRESCOTT, AZ -- Produce Safety & Security International, Inc. ("PDSC"), an ozone and chemical sanitation disinfectant process supplier to the food and medical industries, provides an FDA and EPA approved solution for Dairy Farm Premise Disinfection for the dairy industry by using the Ozone Process and Spherequat
09/05/2006 September 5, 2006 - In a launch dubbed "the new face of solar," Applied Materials has unveiled its strategy to make solar photovoltaic equipment its biggest growth engine, leveraging recent acquisitions and existing technology and processes from its semiconductor and flat-panel areas.
09/05/2006 September 5, 2006 - Synopsys Inc. and Chinese foundry Semiconductor Manufacturing International Corp. (SMIC) have developed and deployed a third-generation reference design flow based on SMIC's 90nm process.
09/05/2006 August 24, 2006 -- /C5/ -- DENVER, CO -- C5 Medical Werks, a wholly-owned subsidiary of CoorsTek founded by President Brad Coors in October 2005, has quickly established itself among the top biotech companies in Colorado.
09/05/2006 August 24, 2006 -- /BUSINESS WIRE/ -- BIRMINGHAM, Ala. --MedMined, a wholly owned subsidiary of Cardinal Health, today announced that it has reached a major milestone, now providing its sophisticated infection-tracking service to improve patient safety and reduce healthcare costs to 200 hospitals in the United States.
09/05/2006 Worldwide sales of semiconductors totaled $20.1B in July, up 11.5% from July 2005, according to the Semiconductor Industry Association (SIA), which co-produces the ITRS and monitors the U.S. domestic semiconductor market. July's sales, compared to the $19.8B reported in June 2006, rose 1.8%.
09/05/2006 September 5, 2006 - Promos Technologies has applied for government approval on two planned 300mm flash memory fabs at the Central Taiwan Science Park, with projected costs exceeding $5 billion by the time of projected completion in 2008.
09/05/2006 September 5, 2006 - NOR flash memory supplier Spansion Inc. reportedly is contracting Taiwan Semiconductor Manufacturing Co. (TSMC) to produce its NOR flash memory chip and its ORNAND flash memory using 90nm process technologies, starting next year
09/05/2006 Fujitsu Microelectronics America, Inc., in collaboration with Phoenix Technologies Ltd., has created the Fujitsu MBF320 Sweep Sensor with pre-boot authentication (PBA), and biometric software from Cogent Systems. The device, packaged with a finger-guide feature in a 43-pin plastic FBGA module, measures 16 × 6.5 × 0.9 mm and communicates via two interfaces. The security feature will be integrated into desktop, mobile, and tablet PCs.
09/05/2006 Single wafer tooling, developed by SSEC, supports single wafer wet processing for advanced device packaging. Enabling wafer processing without hardware conversions, the tooling handles thin and SEMI standard wafers.
09/05/2006 Imago Scientific Instrument Corp., a provider of atom probe tomographic (APT) microscopes, announced the sale and installation of its Laser Pulse Module upgrade at the University of North Texas' Materials Science and Engineering Group.
09/05/2006 The French city of Toulouse is an aerospace town. The headquarters of Airbus and the French National Center for Space Studies are nearby, as is Aerospace Valley, a French cluster of hundreds of companies and state bodies focused on space.
