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New line of controlled environment apparel launched

09/01/2006  DuPont Personal Protection recently introduced its new line of apparel for controlled environments.

Contamination control and the next node

09/01/2006  Smaller than today’s 65-nanometer state-of-the-art manufacturing, the 45 nm semiconductor processing node looms just a few years ahead.

Advanced Packaging: On the Move

09/01/2006  This Roadshow thing is taking on a life of its own. Our latest trip literally took us from coast-to-coast and back again.

ISO releases new international standard

09/01/2006  The Institute of Environmental Sciences and Technology (IEST) recently announced that the International Organization for Standardization (ISO) has published ISO 14644-8, Cleanrooms and associated controlled environments - Part 8: Classification of airborne molecular contamination.

President of Mexico visits new plastics plant

09/01/2006  GW Plastics (Bethel, Vt.; www.GWPlastcs.com), a high-precision injection molding provider, recently hosted Mexico President Vincente Fox.

FDA nano task force to examine regulatory approaches

09/01/2006  According to a recent announcement by Andrew C. von Eschenbach, acting commissioner of the Food and Drug Administration, the FDA will establish a new nanotechnology task force to examine the agency’s regulatory approaches with regard to nanomaterials used in FDA-regulated products.

Zero tolerance for ESD

09/01/2006  Ionizers, remote sensors, monitoring, and material choices all contribute to control

Ultrapure water production: The inside story

09/01/2006  As both the quality and quantity requirements for contaminant-free water increase, the demands for innovative technologies and improved system designs are creating challenges and opportunities for the multitude of industries that require ultrapure water.

Fire-safe fabs

09/01/2006  It’s been 10 years since Factory Mutual, or FM Global as they are now known, substantially revised and reissued their loss prevention guideline for semiconductor manufacturing fabrication facilities.

SEMICON West Still Hits the High Notes

09/01/2006  There’s always a sense of anticipation when planning for SEMICON West. San Francisco’s weather can be unusually cool, and the industry fluctuates unpredictably as well.

The First Intra-molecular IC on a Single Carbon Nanotube

09/01/2006  Current technology uses field-effect transistors (FETs) with feature sizes smaller than 100 nanometers that start to show some device degradation due to short channel effects.

SiP and 3-D Interconnects

09/01/2006  Integration schemes for Through-wafer Via Devices

Advanced Packaging Celebrates the APAs in Style

09/01/2006  On July 12, 2006, Advanced Packaging celebrated the 6th Annual APA Awards ceremony with style and panache.

A New Hierarchy for Electronic Interconnections

09/01/2006  The hierarchy of electronic interconnections has undergone some significant changes over the last several years.

Lights-out MEMS Manufacturing

09/01/2006  It is well-known in semiconductor manufacturing that fast process feedback leads to better process control, which results in higher yield.

Substrate Handling for High-accuracy Packaging Processes

09/01/2006  Today’s packaging specialists are driving demand for processes and technologies that are both fast and flexible.

Chip-package Co-optimization

09/01/2006  The packaging engineer’s long-time lament is the challenge of an over-designed or too large chip.

Socket-adapter Systems: A Practical Test Alternative

09/01/2006  An Innovative, Space-Saving Approach

X-ray Inspection Technology: Finding Hidden Defects

09/01/2006  Not all packaging and interconnect defects can be detected through in-circuit and functional test.