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BP Microsystems Adds an M

08/28/2006  BP Microsystems, a device programming systems supplier, will change its company name to BPM Microsystems. After 21 years, the company decided to change its name, citing confusion with a Houston-based oil company BP Amoco.

Soitec breaks ground on Singapore SOI fab

08/28/2006  August 28, 2006 - Soitec, Bernin, France, has officially broken ground on its new 300mm wafer fab in Singapore, announced earlier this summer.

Rohm & Haas invests in Nanophase to continue CMP work

08/28/2006  August 28, 2006 - Nanophase Technologies Corp. and Rohm and Haas Electronic Materials' CMP technologies unit have extended a partnership for use of new nanomaterials and nanomaterial dispersions for CMP applications through 2019. Rohm & Haas also has purchased $5 million worth of Nanophase stock.

Mr. Scott Schroeder appointed as vice president finance and CFO at Nanomix

08/28/2006  Nanomix Inc., a leading nanoelectronic detection company commercializing high-value diagnostic and monitoring applications, today announced the appointment of Scott Schroeder as Vice President, Finance and Chief Financial Officer to lead the company's financial and administrative activities.

Haier IC Adopts Simulator for IC Design

08/28/2006  Haier IC chose the Mentor Grapics Corp. Eldo simulator as its standard SPICE simulator for analog circuit design, due to convergence and simulation analysis time abilities.

TSMC reloads lawsuit vs. SMIC

08/28/2006  August 28, 2006 - Taiwan Semiconductor Manufacturing Corp. (TSMC) has renewed its litigation against Chinese rival Semiconductor Manufacturing International Corp. (SMIC), citing breach of a settlement between the two firms signed a year ago.

Soitec breaks ground on Singapore fab

08/28/2006  The manufacturer of SOI wafers and other engineered substrates announced it has broken ground on its new 300 mm wafer fab in Singapore. Designated Fab 3, the facility is expected to start supplying the group's customer base with SOI wafers in mid-2008.

Harvard scientists use nanowires to connect neurons

08/25/2006  August 25, 2006 - As part of ongoing work to improve electrophysiological measurements of brain activity -- not to mention demonstrate the potential of hybrid bioelectronics -- researchers at Harvard U. have linked a solid-state device (a nanowire transistor) to neuronal projections that interconnect and carry information in the brain.

Compound semi firm opens new production site

08/25/2006  August 25, 2006 - SemiSouth Laboratories, Starkville, MI, a privately held company formed in 2000 to commercialize silicon carbide (SiC) electronic materials and device technologies developed at Mississippi State U., has officially opened a new multimillion-dollar silicon carbide manufacturing facility, and completed "a large portion" of equipment installation.

Silterra, eMemory verify CMOS programmable memories

08/25/2006  August 25, 2006 - Embedded memory developer eMemory Technology says it has verified its Neobit one-time programmable memory on foundry Silterra Malaysia Sdn. Bhd.'s 0.18-micron CMOS process technologies, and will have a 0.13-micron version of the design ready for silicon validation by year's end.

Bede, IMEC eyeing X-ray metrology for 45nm node

08/25/2006  August 25, 2006 - Bede X-ray Metrology and European research consortium IMEC have entered into a collaboration to investigate the use of X-ray metrology for process control and characterization of new semiconductor materials used at the 45nm node and below.

BASF spending "double-digit millions" to boost semi materials output

08/25/2006  August 25, 2006 - BASF says it is investing a "double-digit million euro" sum in a new plant for producing process chemicals used in the semiconductor industry. The new Electronic Material Center in Ludwigshafen is scheduled to open by the end of 2007.

Trio-Tech Expands Test and Burn-in

08/25/2006  Trio-Tech International will expand its Suzhou, China, facility to include specialized testing and burn-in services, and will manufacture burn-in equipment for China's backend semiconductor market. The facility will be completed in Q'04 2006.

PI announces new translation stage

08/25/2006  PI of Auburn, Mass., announced its P-652 piezoelectric linear-motor driven translation stage.

Pennsylvania governor announces new state nano investments

08/25/2006  Pennsylvania Governor Edward G. Rendell said the commonwealth will invest $11.1 million to support Pennsylvania's scientists and researchers in nanotechnology and engineering research.

Surface analysis firm adds AML's spectrometry assets

08/24/2006  August 24, 2006 - Evans Analytical Group LLC, Sunnyvale, CA, a provider of microanalytical surface analysis and materials characterization services, has acquired the operations and assets of Applied Microanalysis Labs Inc. (AML), an independent lab specializing in static and dynamic secondary ion mass spectrometry (SIMS) techniques, for an undisclosed amount.

DEK Expands Online Support

08/24/2006  DEK machine owners can download 3-D engineering models for all company printer subassemblies over broadband Internet, allowing operators to examine components in detail without taking a machine offline, or verify and order parts or upgrades.

Scientists prototype new chip cooling device

08/24/2006  August 24, 2006 - Researchers at the U. of Washington have built a prototype of a cooling device that uses an ion pump to create a cooling air jet directly on a chip's surface. Trial runs of the device, which uses an electrical field to accelerate air to speeds comparable to those from traditional blowers, show "significantly cooling" on just 0.6W of power.

Wilf Corrigan Keynotes at IWLPC

08/24/2006  Wilfred "Wilf" J. Corrigan, founder of Milpitas, Calif.-based LSI Logic, will keynote the International Wafer-level Packaging Conference (IWLPC) November 2, 2006, at the Wyndham Hotel in San Jose, CA. Former president, chairman, and CEO of Fairchild Camera & Instrument Corp., Corrigan is considered an integral member of Silicon Valley's history.

Forum Explores Southwestern Markets

08/24/2006  The IMAPS Global Business Council (GBC) will hold the IMAPS 2006 Marketing Forum on October 11, 2006. The program emphasizes technologies prevalent in Southern California/Southwestern U.S. Our presenters are enthusiastic about the microelectronics business and market information, agreed Arne Knudsen of Kyocera America and Harry Kelzi of Teledyne Microelectronics, both members of the forum's program committee.