08/15/2006 Silicon Storage Technology (SST) announces a Z-scale package based on a serial flash with small and thin form factor. The package measures 0.4 × 3 × 3 mm, depending on chip memory density. As a wafer-level package, the Z-scale product uses multi-layer metal interconnect and routing technology. The interconnect system redistributes each chip's bonding pads to external bumps. These bumps connect directly to the circuit board, or to another substrate.
08/15/2006 General observations from this year's IEEE Lithography Workshop suggest that immersion lithography may take a little longer to move into mass production than its champions would like, and the path to the 32nm half-pitch node is also not clear. Still, the pursuit of Moore's Law continues on many fronts, such as finding ways to "cheat" the "laws" of optical physics, or using organic self-assembly techniques to augment optical lithography.
08/15/2006 Several talks at SEMICON West this year focused on one of the industry's most rapidly growing segments: solar technology. Equipment suppliers need to address a lack of suitable tools for production of photovoltaic (PV) technology, or else vendors will end up developing their own tools. Meanwhile, PV programs in Japan and Germany are inspiring efforts in the US to spur demand. And the search continues for alternative materials to silicon, with PV products closing in on 40% efficiencies.
08/15/2006 Q'02 2006 worldwide semiconductor manufacturing equipment bookings increased 60% from Q'02 2005. Billings for the second quarter also went up, from $7,576 million in 2005 to $9,594 million in 2006. The figures represent a 27% increase from year-to-year. China experienced exponential growth, while North America and Europe saw moderate gains.
08/15/2006 August 15, 2006 - RF components supplier Sirenza Microdevices Inc., Broomfield, CO, has agreed to acquire fabless company Micro Linear Corp. in a stock deal valued at about $45.6 million, strengthening the company's position in markets for digital TV set-top boxes and high-volume digital cordless phones.
08/15/2006 August 15, 2006 - Synova, a privately held Swiss developer of water jet-guided laser technology, has secured an additional $8.1 million (CHF 10 million) in funding from Swiss banks, to help fuel its push to create several micromachining centers in key high-tech regions around the world.
08/15/2006 August 15, 2006 - Kopin, Hitachi Cable, and IQE took the top three spots among merchant suppliers of epitaxial material in 2005, due to heavy demand for semi-insulating (SI) GaAS epi substrates, a market that is expected to surge to $487 million by 2010, according to data from Strategy Analytics.
08/15/2006 August 15, 2006 - Worldwide sales of semiconductor manufacturing equipment rose just a fraction in 2Q06 from the previous quarter, but a big push in orders suggests significant demand for new tools, according to new data from SEMI.
08/15/2006 Two fourth-generation image-processing chips, joining the Milbeaut line from Fujitsu, integrate several functions. The MB91683 and MB91686 are manufactured using 300-mm wafers and 90 nm process technology to create a large-scale IC for digital cameras.
08/15/2006 MagnaChip Semiconductor's one-chip, high resolution LCD driver supports high resolution at QVGA level. The MC2TA7501 has a 30% smaller form factor than MagnaChip's previous generations of chipsets.
08/15/2006 China Nanotech Inc., formerly Zeolite Exploration Co., a nano precipitated calcium carbonate (NPCC) and coal-based chemical products manufacturer in the People's Republic of China, announced the opening of its new NPCC factory in Xianyang City, Shaanxi province.
There are so many exciting areas where packaging plays a vital role. In this global market place, who decides where a product is manufactured or what is the best sales channel to bring product to the worldwide market? Smaller, cheaper, faster may be the mantra; however, reliability may be replacing that mantra. After nine Advanced Packaging Roadshow tours in the U.S., these issues come to the forefront.
08/14/2006 On Track Innovations Ltd (OTI), manufacturers of contactless, microprocessor-based smart card solutions, announced that Polish Public Printing Works began ordering with ASEC S.A., OTI's wholly-owned subsidiary. OTI emphasized an interest in the emerging European Union market, especially with new members like Poland. Under the contract, ASEC will supply contactless inlays that will be adhered to Polish citizens' passport covers.
08/14/2006 In-Stat's Fall Microprocessor Forum, October 9 – 11, will begin with an updated presentation by Max Baron, principal analyst for Microprocessor Report. Titled "Maximum Performance, Minimum Power," the seminar is dedicated to low power advances. The 10th and 11th will encompass keynotes and moderated sessions on technology trends and issues.
As representatives from different companies described their latest technologies, products, and services during SEMICON West, held at the Moscone Center in San Francisco, July 10 – 13, several key points kept hitting home.
08/11/2006 it offers a broad perspective on electronic packaging. Definitions, classifications, and background lead to a technical discussion of the material, application, or process. Logically, the first term defined is "electronic package."
08/11/2006 NEC Corporation, NEC Electronics, and subsidiary NEC Electronics America, together created a SiP technology for stacking logic and gigabit-class memory in a single package. The technology will reportedly enable image processing in mobile applications. The SMAFTI product combines a SMArt connection with a feed-through imposer. It uses a 3-D chip connection and a 50-micron pitch microbump between the logic and memory devices.
08/11/2006 August 10, 2006 - Nova Measuring Instruments Ltd., Rehovoth, Israel, said that its two cofounders and top execs have stepped down, amid a transition into a new phase of growth.
08/11/2006 The electronics group of Henkel will increase representation in India with augmentations to its sales and technical personnel departments, as well as investments in local product manufacturing. The company appointed Bhavesh Muni global director of business development in the region. He will direct India-region growth.
08/10/2006 Robert Haavind, editorial director for Solid State Technology Magazine, received a national gold award from the American Society of Business Press Editors (ASBPE). Haavind's editorials in the September 2005 and November 2005 issues of Solid State Technology — titled "Educating innovators" and "The future of energy" — were chosen as the best editorials for all business-to-business (B2B) magazines with a circulation under 80,000.
