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Dow corning, Rohm and Haas pair for sub-65nm litho coatings

07/10/2006  July 10, 2006 - Rohm and Haas Electronic Materials Microelectronic Technologies and Dow Corning Corp. have renewed a joint development agreement to work on novel spin-on silicon hardmask antireflective coatings for sub-65nm lithography in flash, DRAM, and logic IC devices.

OnWafer extends plasma process control offerings with AE unit deal

07/10/2006  July 10, 2006 - OnWafer Technologies, Pleasanton, CA, has acquired the plasma management division of Advanced Energy Industries Inc., including IP and technology-related assets, in a move to extend its position in plasma process control and diagnostics wireless metrology technology. Terms of the deal were not disclosed.

Novellus, SEMATECH ATDF forge ahead with ULK test wafers

07/10/2006  July 10, 2006 - SEMATECH's Advanced Technology Development Facility (ATDF) and Novellus Systems Inc. are readying next-generation porous low-k test wafers for equipment makers and materials suppliers to evaluate their products with leading-edge ultralow-k (ULK) materials, eyeing the 2007 production target set down by the ITRS.

Vacuum automation firm nabs funding from Intel, VCs

07/10/2006  July 10, 2006 - BlueShift Technologies Inc., a manufacturer of a wafer-processing platform utilizing vacuum and automation technologies founded by former Brooks Automation execs, has secured a Series B round of financing totaling $12 million, to accelerate product launch activities and fuel expansion into international markets.

Synova expands manufacturing ops to US

07/10/2006  July 10, 2006 - Synova, a privately held Swiss developer of water jet-guided laser technology, is planning to open a micromachining center in Silicon Valley to tap into local growth markets including inkjet printer head MEMS, hard disk drive (HDD) and organic light emitting diodes (OLEDs).

Freescale touts volume output of MRAM devices

07/10/2006  July 11, 2006 - Freescale Semiconductor says it has ramped to volume production of its 4Mbit, 0.18µm-based magnetoresistive random access memory (MRAM) devices.

Sheldon Manufacturing, Inc. launches online store to meet growing demands from researchers and scientists

07/10/2006  July 7, 2006 -- /PRWEB/ -- Cornelius, OR -- Research studies show that the quantity of online purchases will increase by up to 55% over the next 2-3 years for laboratory products and equipment (Laboratory Equipment Magazine, Lab Trends 2006, pg. 40).

Air Liquide's Balazs Analytical Services announces three new tests for speciation of total oxidizable carbon in ultrapure water

07/10/2006  July 7, 2006 -- Fremont, Calif. -- Balazs Analytical Services, a division of Air Liquide Electronics U.S. LP, announces three new tests for Total Oxidizable Carbon (TOC) speciation in ultrapure water (UPW).

ALTANA opens pharmaceutical production facility in Ireland

07/10/2006  July 7, 2006 -- /BUSINESS WIRE/ -- BAD HOMBURG, Germany & CORK, Ireland -- ALTANA Pharma, the pharmaceutical division of ALTANA AG today performed the official opening of a new tablet production facility in Cork (Ireland) in the presence of the Irish Prime Minister, Mr. Bertie Ahern.

Olympus system inspects wafer top, back, edge and bevel

07/10/2006  July 7, 2006 -- /BUSINESS WIRE/ -- SAN JOSE, Calif. -- Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan, introduces the Model AL3300 optical inspection and defect review system for full top, edge, bevel and back side inspection of 300 millimeter wafers.

New Aktiv Preclean extends Applied Materials' PVD barrier-seed technology leadership in 45nm and beyond

07/10/2006  July 10, 2006 -- /BUSINESS WIRE/ -- SANTA CLARA, Calif. -- Applied Materials, Inc. today announced a significant enhancement to its Applied Endura(R) CuBS (copper barrier/seed) system with the new Aktiv(TM) Preclean chamber, extending the system's leadership position in 45nm-generation copper-low k interconnects.

Applied Materials delivers key technology for 45nm contacts with Endura iLB II System

07/10/2006  July 10, 2006 -- /BUSINESS WIRE/ -- SANTA CLARA, Calif. -- Applied Materials, Inc. today announced its Applied Endura(R) iLB(TM) II (integrated liner/barrier) system, which combines major advances in PVD(1) titanium (Ti) and preclean technologies to reduce resistance in critical contact structures by up to 40%.

Should the semiconductor industry worry now or later?

07/10/2006  July 10, 2006 -- /MARKET WIRE/ -- SARATOGA, CA -- Debate as to whether the IC industry is approaching a turning point or will maintain its growth momentum continues to rage, fueled by growth statistics of ICs and many equipment and materials segments that are reaching record levels.

Air Liquide Electronics strengthens its production capacity for high-tech molecules

07/10/2006  July 6, 2006 -- /Air Liquide/ -- The electronic chip, omnipresent in our everyday lives in computers, mobile phones and MP3 players, must live up to leading-edge performance and exceptional properties: ever-increasing capacity in memory, speed and power.

Entegris launches new immersion lithography innovation

07/10/2006  July 6, 2006 -- /BUSINESS WIRE/ -- CHASKA, Minn. -- Entegris, Inc. (Nasdaq:ENTG) announced today that it will introduce its LiquidLens(TM) UPW (ultrapure water) purification system next week at the semiconductor global trade show SEMICON West 2006 in San Francisco.

RASIRC introduces Intaeger UHP ultra-high-purity steam generator

07/10/2006  July 6, 2006 -- /BUSINESS WIRE/ -- SAN DIEGO -- RASIRC(TM), the steam purification company, introduces its first product, the Intaeger(R) UHP (Ultra High Purity) fully automated steam generator.

Micralyne Expands with SUSS

07/10/2006  Micralyne, a MEMS components manufacturer, announced it has purchased SB6e wafer bonder and BA6 aligner systems from SUSS MicroTec, Inc.

Freescale unveils production MRAM

07/10/2006  The first commercial magnetoresistive random access memory (MRAM) device is now in volume production and available from Freescale Semiconductor.

Digital Hearing Aids Adopt RF

07/07/2006  Interton, a hearing aid system manufacturer, has selected AMI Semiconductor (AMIS) to develop advanced wireless capabilities for hearing aid devices. The battery life expectancy for hearing devices complicates additions of wireless technology; therefore, AMIS will develop ultra low-power radio frequency (RF) subsystems for devices.