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Cadence and ARC Unite Against Sub-100-nm Problems

06/30/2006  Sub-100-nm processes require extra attention to ensure that designs are manufacturable with acceptable yield. Cadence Design Systems and ARC address this situation by integrating the Cadence Encounter digital IC design platform into ARC's ARChitect processor configuration tool. "The product integration will really help designers," said Lou Scheffer at Cadence.

Raymor begins production of single-walled carbon nanotubes from high capacity production unit

06/30/2006  Raymor Industries Inc. (TSX VENTURE: RAR), a developer and producer of single-walled carbon nanotubes, nanomaterials and adanced materials, announced that the company's wholly-owned subsidiary, Raymor Nanotech, has begun producing single-walled carbon nanotubes (C-SWNT) from its high capacity production unit.

Toshiba licenses Staktek's NAND flash stacking technology

06/30/2006  June 30, 2006 - Toshiba Corp. has licensed certain stacking technologies for NAND flash memory leaded packages, the two firms stated. Financial details of the two-year deal or the specific technologies licensed were not disclosed.

Flash memory firm expanding work with Intel, Micron

06/30/2006  June 30, 2006 - Nanosys Inc., Palo Alto, CA, says it has expanded its technology collaboration with Intel Corp. to include flash memory partner Micron Technology Inc., targeting development of nanostructures for high-density NAND flash memory for consumer electronics and portable storage applications.

Flash Memory Collaboration Courts Wireless Market

06/29/2006  Data I/O and Spansion announced their collaboration in sales, marketing, and systems engineering to promote the use of automated Flash memory programming in wireless, consumer, and automotive products. Spansion will assume rights to licensing Data I/O software related to device programming, conduct cooperative engineering development and participate in customer communications and field support.

Customers Choose Chip-making Equipment Industry's Top 10

06/29/2006  Nextest Systems Corporation, an automatic test equipment (ATE) manufacturer, topped the list in an annual double-blind survey conducted by VLSI Research, Inc. The survey—The 2006 VLSI Research 10 BEST Suppliers of Test Equipment.

sp3 wins Fed deal to develop GaN on silicon/diamond

06/29/2006  June 29, 2006 - sp3 Diamond Technologies Inc., Santa Clara, CA, a developer of diamond substrate technology for enhancing thermal management, has received a $750,000 Phase II contract from the Missile Defense Agency to develop gallium nitride (GaN) on silicon-on-diamond devices.

SPT, Microbonds align wire bonding strategies

06/29/2006  June 29, 2006 - Small Precision Tools and Microbonds Inc. plan to align their technology roadmaps to combine SPT's advanced wire bonding capillaries with Microbonds' X-Wire insulated wire bonding technology.

Elpida selling shares, seeks funds for expansion

06/29/2006  June 29, 2006 - Elpida Memory Inc. says it will issue 30 million new shares to raise roughly 141 billion yen (US $1.22 billion) to help finance planned expansion at its 300mm DRAM facility in Hiroshima Prefecture.

Analyst: Probe card market nearing $1B in 2006

06/29/2006  June 29, 2006 - After a 20% surge in 2005, the probe card market is expected to enjoy another solid year of growth in 2006 due largely for memory test needs, according to a new report from VLSI Research Inc.

Top backend, materials vendors emphasize tool performance, notes analyst survey

06/28/2006  June 29, 2006 - Accretech-Tokyo Seimitsu, Nextest Systems, and S

ASE gains $247M in facility fire settlement

06/28/2006  June 28, 2006 - Semiconductor packaging service provider Advanced Semiconductor Engineering Inc. has reached a final settlement with nine insurance companies regarding a fire at its facilities in Chung-Li in May 2005.

SMIC, Chinese investment firm building 300mm fab

06/28/2006  June 28, 2006 - An investment company associated with the Hubei provincial government has broken ground on a new 300mm chipmaking facility, with Semiconductor Manufacturing International Corp. set to manage, but not own, the plant.

IntelliSense ships IntelliSuite upgrade

06/28/2006  IntelliSense announced the availability of a major upgrade to its IntelliSuite family of MEMS and Nano CAD tools. IntelliSuite v8.1 (2006) includes several new capabilities.

IBM and Georgia Tech Take It to the Limit

06/27/2006  IBM and the Georgia Institute of Technology announced production of a prototype chip that breaks the 500 GHz operating frequency record. Research was supported by IBM, NASA, and the Georgia Electronic Design Center (GEDC), where it was carried out on a specialized high-frequency test system.

Samsung unveils 60nm-based 2GB flash memory

06/27/2006  June 27, 2006 - Samsung Electronics Co. Ltd. says it has successfully developed a 2GB version of its OneNAND flash memory device using 60nm process technologies, increasing write speeds by more than 80% vs. its 1GB version and exceeding that of NAND flash.

VLSI: Industry slows slightly before June ramp

06/27/2006  June 27, 2006 - Demand for worldwide semiconductor manufacturing equipment slipped in May after a very strong two-month period, but demand for chip tools continues to be well ahead of last year's pace heading into the seasonally strong summer months, according to data from VLSI Research Inc.

Calif. company shines nano light on drug development

06/27/2006  In drug discovery work, researchers trying to identify potential new therapies rely on luminescence to identify compounds that interact with a target – that is, a potential new drug. Now a group of researchers at Lumiphore Inc. in Redwood City, Calif., have designed a new type of drug test that can help them discover new compounds at a lower cost than previous methods.

Invensense unveils MEMS sensor for handhelds

06/27/2006  InvenSense, a provider of motion sensing devices for mobile applications, announced a gyroscope-based solution for handsets intended to enable easier and more intuitive user interaction through hand motions.