06/13/2006 The 9th annual International Interconnect Technology Conference again brought together hundreds of the world's leading semiconductor manufacturers, equipment and materials suppliers, and research centers for three days of comparing notes and competing for bragging rights. Among the highlights: detailed information on likely 45nm dual-damascene Cu/porous-low-k integration, and using dielectric "air-gap" large structured pores as a comparable and perhaps less expensive manufacturing alternative.
06/13/2006 June 13, 2006 - Fuji Photo Film Co. Ltd. has agreed to acquire Dimatix Inc., a developer and manufacturer of industrial inkjet printheads, precision micropumps, and specialized print systems, for an undisclosed amount. The company develops systems for jetting fluids such as nanoparticle-based metallic and organic materials in applications such as microelectronic packaging substrates.
06/13/2006 June 13, 2006 - The market for fab automation tools, characterized as "extremely volatile" and often trending opposite to the rest of the equipment industry, is poised for significant growth over the next two years thanks to the ongoing migration to using 300mm wafers in semiconductor manufacturing, according to one analyst.
06/13/2006 Dimatix Inc., a Santa Clara, Calif., developer and manufacturer of industrial ink jet printheads, precision micropumps and specialized print systems, announced that it has agreed to be acquired by Fuji Photo Film Co. Ltd. The transaction is expected to close in late July.
06/13/2006 Construction of a $16 million underground nano research building got underway last week in Eugene, Oregon. University of Oregon scientists say the facility will provide a solid foundation for nanotech research, both literally and figuratively.
06/12/2006 June 12, 2006 - South Korea's Dongbu Electronics says it has completed development of a NOR flash memory process with Taiwan's Eon Silicon Solution Inc. using 0.13-micron process technology on 200mm wafers. Volume production is expected to begin in 3Q06, ramping to 3000 wafers/month in 2007.
06/12/2006 June 12, 2006 - Citing stronger than expected growth in several key end-markets -- notably cell phones -- the Semiconductor Industry Association (SIA) has brightened its semiannual forecast for the semiconductor industry, following a similar recent upgrade from the World Semiconductor Trade Statistics group (WSTS).
06/12/2006 June 12, 2006 - NEC Electronics America Inc., Santa Clara, CA, says it has developed 55nm standard CMOS process technology (dubbed "UX7LS) to be used with next-generation, ultralow-power consumption systems-on-chips (SoC), as well as the company's CMOS-compatible DRAM technology.
06/12/2006 June 12, 12006 -- Intel Corp. is ready to show off results of its work with CMOS tri-gate transistors at this week's VLSI Symposium in Hawaii, touting its successful integration of high-k gate dielectrics, metal gate electrodes, and strained silicon to offer considerably lower leakage and consume much less power than today's planar transistors. The devices could become the basic building blocks for future microprocessors beyond the 45nm node.
06/12/2006 Semtech Corp. and Digi-Key Corp. signed a distribution agreement that offers Semtech's power management, protection, and embedded wireless modules through Digi-Key's print and online catalogs.
06/12/2006 QD Vision Inc. announced it has manufactured a quantum dot display. The company said the monochrome display demonstrates the manufacturability and commercial feasibility of quantum dot technology as a foundation for next generation displays.
06/09/2006 June 9, 2006 - Korean fabless chip firm Tomato LSI and IP licensing firm Clairvoyante say they have produced the world's smallest single-chip IC driver for amorphous silicon TFT VGA display panels, in response to demand for high-resolution panels used in handheld mobile devices.
06/09/2006 A comprehensive discussion of the semiconductor supply chain will be presented at the U.S. Technology Symposium on July 10th, with industry experts from Motorola, Hewlett-Packard, Intel, Samsung, Cadence, Prismark Partners, and Tessera speaking. The symposium — taking place the day before SEMICON West opens — is structured to offer a broad view of the technologies and trends driving the future of electronics miniaturization and performance.
06/09/2006 Akustica announced a joint venture with Ricoh Company, Ltd., to develop a camera module solution using AKU2001, a digital output microphone chip. The companies expect the collaboration to speed time-to-market production on video and voice over internet protocol (VVoIP). The camera module will be used for universal serial bus (USB) audio/video (A/V) applications.
06/09/2006 June 9, 2006 - The latest batch of midquarter outlooks are out from several semiconductor manufacturers and equipment suppliers, with mixed results. Kulicke & Soffa says its wire bond customers aren't clear about long-term spending plans, while Novellus is getting a boost from memory manufacturers' expansions.
06/09/2006 June 9, 2006 - FormFactor has unveiled new wafer probe card technology to address challenges associated with one-touchdown 300mm flash wafer probing.
06/09/2006 June 9, 2006 - BOC Edwards and JV partner BOD Lien Hwa have begun work on the next phase of expansion of the company's nitrogen production pipeline distribution network in the Hsinchu Science Park in northern Taiwan.
06/09/2006 The company announced that Haemonetics Corp. of Braintree, Mass., will acquire the outstanding shares of Arryx that it does not already own for $26 million in cash.
06/09/2006 Zyvex of Richardson, Texas, and Arkema of Paris announced their intention to strengthen their strategic partnership by jointly developing commercial nanomaterials applications.
