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PrimeGen Biotech LLC spins off PrimeCell(TM) Therapeutics -- Wholly owned subsidiary to work exclusively on first human adult pluripotent stem cell

05/19/2006  May 16, 2006 -- /BUSINESS WIRE/ -- IRVINE, Calif. -- PrimeGen Biotech LLC (http://www.primegenbiotech.com) today announced that it has created a wholly owned subsidiary -- PrimeCell Therapeutics LLC -- to work exclusively on the therapeutic development of PrimeCell(TM), the first adult, non-embryonic stem cell capable of transforming into any cell type found in the body.

Cleanroom professionals attack contamination head-on: Unotron's washable computer keyboards, mice and smart card readers support compliance and optimal environment

05/19/2006  May 16, 2006 -- /BUSINESS WIRE/ -- DALLAS -- To counter the concerns of cleanroom professionals that computer keyboards and other peripherals are contributing to rising infection rates, airborne contamination and possible product corruption, Unotron, Inc. confirms that its SpillSeal(R) patented technology allows its keyboards, mice and smart card readers to be repeatedly washed and disinfected.

SEMI: NA equipment orders spike in April

05/19/2006  May 19, 2006 - Demand for semiconductor manufacturing equipment from North American suppliers continued to ramp up in April, as the industry enjoys its strongest growth period in nearly two years, according to new data from SEMI.

ASMI lays out business case for shareholders

05/19/2006  May 19, 2006 - At its annual meeting of shareholders, ASM International NV presented a "roadmap" for its corporate strategy going forward, and proclaimed it will achieve profitability in its maligned frontend equipment business in 2007.

Raymor subsidiary receives order from Boeing

05/19/2006  Raymor Industries announced that its wholly-owned subsidiary, AP&C Advanced Powders and Coatings has received an order from Boeing (NYSE: BA) for the purchase of spherical nitinol powder for use in its next generation of composite aerospace applications.

SEMI: 1Q tool sales spike 20%

05/18/2006  May 18, 2006 - Worldwide semiconductor manufacturing equipment sales jumped 20% in 1Q06 from the prior quarter, due to robust growth in North America and South Korea, although Korea's tool sales have slowed significantly from last year's levels, according to new data from SEMI.

IMEC extends Ge, III-V work to sub-22nm CMOS

05/18/2006  May 18, 2006 - European microelectronics consortium IMEC and Riber, a French supplier of molecular beam epitaxy (MBE) technology for compound semiconductors, are collaborating to introduce germanium (Ge) and III-V materials for CMOS scaling beyond the 22nm manufacturing node and beyond.

TSMC ramping 65nm process

05/18/2006  May 18, 2006 - Taiwan Semiconductor Manufacturing Co. (TSMC) says it has fully qualified its 65nm low-power process technology, with several products already ramped and delivering production volumes.

Mitsubishi unveils organic FPD material

05/18/2006  May 18, 2006 - Researchers at Mitsubishi Chemical Corp.'s Science and Technology Research Center (MCRC) and Japan's Ehime U. and Kyushu U. have developed a new organic semiconductor material, processed by low-cost wet coating methods, for use with new large flat-panel displays (FPD).

Toshiba shines alone in 1Q NAND flash ranks

05/17/2006  May 17, 2006 - Toshiba made big strides in NAND flash sales in 1Q06 to pull away from the pack as the clear No. 2 supplier behind market giant Samsung, mainly because everyone else took a bigger hit in ASPs, according to new data from iSuppli Corp.

Renesas, Nanya bury DRAM hatchet

05/17/2006  May 17, 2006 - Renesas Technology Corp. and Nanya Technology Corp. have settled four pending lawsuits filed by Renesas claiming patent infringement by Nanya's DRAM products, and have signed a cross-licensing agreement.

SEMI Posts Q1 '06 Worldwide Equipment Figures

05/17/2006  San Jose, CA — Worldwide semiconductor manufacturing equipment billings reached $9.58 billion in Q1 2006, reports SEMI. The billings figure is 22% higher than Q4 2005, and about 3% above the same quarter last year. SEMI cooperates with the Semiconductor Equipment Association of Japan (SEAJ) to gather the data — more than 150 global equipment companies provide such data on a monthly basis.

Researchers develop "fishy" way to improve OLEDs

05/17/2006  May 17, 2006 - Scientists from the U. of Cincinnati claim to have developed a method to make organic light-emitting diodes (OLED) as much as 10x more efficient and 30x brighter -- with a little help from the humble salmon fish.

ATDF, U-Texas open nano R&D center

05/17/2006  May 17, 2006 - SEMATECH's R&D fab subsidiary Advanced Technology Development Facility (ATDF) and the U. of Texas-Austin have formed an Advanced Processing and Prototyping Center (AP2C), a specialized R&D program to develop leading-edge nanotechnology for use in semiconductor manufacturing.

TSMC lays out 65nm DFM plan

05/17/2006  May 17, 2006 - Taiwan Semiconductor Manufacturing Co. (TSMC) has unveiled a 65nm design-for-manufacturing compliance "ecosystem" to channel DFM capabilities through selected EDA tools to TSMC's manufacturing data format.

Virginia Tech uses nano products to protect athletes

05/17/2006  Virginia Tech is utilizing a nanotech product to protect athletes utilizing its synthetic turf fields, sports medicine training room, locker rooms, whirlpools and wrestling rooms.

Owlstone to ship chemical detection product

05/17/2006  Owlstone Nanotech announced that its chemical detection device, the Owlstone Tourist, is now available. The device is based on the company's micro-machined gas sensor and utilizes technology that the company says is smaller and less expensive than existing technology.

Underfill Technology Then, Now, and Tomorrow

05/16/2006  Underfill systems have been used in packaging applications for nearly 20 years — first introduced by IBM and then made commercially available from Henkel to the wider marketplace in the 1980s. Since this time, the materials have evolved significantly and, as technology advances, new uses and applications are being discovered everyday.
By George Carson, Ph.D., and Michael Todd, Ph.D., the electronics group of Henkel