05/15/2006 Herndon, VA — The International Electronics Manufacturing Initiative (iNEMI) will hold a 2007 Roadmap workshop in Shanghai, China, in tandem with the High-density Microsystem Design and Packaging and Component Failure Analysis in Electronics Manufacturing (HDP) 2006 conference. The half-day workshop will take place June 27, 2006, on the Yan Chang Campus of Shanghai University.
05/15/2006 May 15, 2006 - Applied Materials Inc., Santa Clara, CA, and Japan's Dainippon Screen Mfg. Co. Ltd. (DNS) are forming a joint venture to offer track technologies for semiconductor manufacturing.
05/15/2006 Applied Materials Inc. announced that it has signed an agreement to create a joint venture company with Dainippon Screen Mfg. Co. Ltd. to deliver track solutions for customers' critical semiconductor manufacturing requirements.
05/15/2006 Cascade Microtech announced it will be providing Agilent Technologies Inc. with WinCal 2006 high frequency measurement calibration software. The software will be used to support to Agilent's ENA Series Network Analyzers.
05/12/2006 May 12, 2006 - Varian Semiconductor Equipment Associates Inc., Gloucester, MA, and Japan's Nissin Ion Equipment Co. Ltd. have quietly settled patent litigation in a Texas court.
05/12/2006 May 12, 2006 - Samsung Electronics, Hynix Semiconductor, and Infineon Technologies are digging into their wallets once again over their participation in a DRAM price-fixing scheme several years ago.
05/12/2006 May 12, 2006 - Toshiba Corp. plans to spend roughly 2 trillion yen (US $18.03 billion) between fiscal years 2006 and 2009, nearly double the amount from the previous three years -- and that amount is likely to go up if semiconductor demand keeps rising, according to the Nihon Keizai Shimbun.
05/12/2006 May 12, 2006 - Infineon Technologies AG has announced availability of its first cell phone chips utilizing 65nm CMOS process technology, leveraging its development and manufacturing alliance with IBM, Chartered, Infineon, and Samsung.
05/12/2006 May 12, 2006 - Crystal IS, Green Island, NY, says it has developed a new manufacturing technique to grow a crystal that can be sliced and polished to be used as a substrate for use in high-power RF electronics, blue, and UV optoelectronics.
05/12/2006 Austin, TX — Freescale Semiconductor appointed William R. Bradford senior VP of global sales, in which he will front sales for Freescale across all markets and business units worldwide. Bradford will report directly to Michel Mayer, Freescale's chairman and CEO.
05/12/2006 NanoDynamics Inc. announced the addition of Phillip Bond to the nanomaterials company's business and scientific board of advisors. Bond will be lending his expertise in government relations and public policy to the fast-growing nanomaterials manufacturing and technology firm.
05/12/2006 Uni-Pixel Inc. announced that it has entered into an agreement with the Palo Alto Research Center (PARC) to collaborate on the development and commercialization of Uni-Pixel's TMOS display technology.
