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Brewer Science partners with Arkema to develop high-chi DSA materials for advanced node patterning

07/10/2017  Brewer Science Inc. today announced from SEMICON West the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers.

Imec demonstrates electrically functional 5nm solution for back-end-of-line

07/10/2017  At its annual Imec Technology Forum USA in San Francisco, imec today presented an electrically functional solution for the 5nm back-end-of-line (BEOL).

SEMICON West preview: New “Meet the Experts” program

07/07/2017  SEMI adds a new speaker program called “Meet the Experts” at SEMICON West (July 11-13) in San Francisco this year.

SUNY Poly-led AIM Photonics and NY-Power Electronics Manufacturing Consortium to highlight research, collaboration at SEMICON West 2017

07/06/2017  Prominent New York State Tech Pavilion and Nanotech Summit at SEMICON West Exhibition to showcase innovation-based business growth opportunities

Busch COBRA BC achieves 12 year milestone at GlobalFoundries Fab 1

06/29/2017  Twelve years of continuous operation amounts to over 18.9 billion rotations.

New class of 'soft' semiconductors could transform HD displays

06/29/2017  Berkeley Lab researchers find tunable halide perovskites could usher in new generation of optoelectronic devices.

Taiwan Compound Semiconductor Seminar ? Envisioning next-gen communications

06/29/2017  Market demand is driving development of 5G network standards, and commercial applications are expected to be introduced by 2020.

New Taiwan Automation Technology TC chapter

06/29/2017  At its recent Spring 2017 meeting, the North American Regional Standards Committee (NARSC) approved formation of a Taiwan chapter of the global SEMI Standards Automation Technology Committee.

Umicore inaugurates new production facility in Germany

06/29/2017  UmicoreÂ’s business unit Precious Metals Chemistry today inaugurated its production unit for advanced metal organic precursor technologies used in the semiconductor and LED markets.

Leti and Fraunhofer team up to strengthen microelectronics innovation in France and Germany

06/29/2017  Two European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty.

Presto Engineering announces management expansion

06/29/2017  Presto Engineering, Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces a management expansion: Cedric Mayor has been named Chief Operating Officer (COO) and Martin Kingdon has been appointed VP Sales.

Micron and SEMI partner to host High Tech U in Silicon Valley

06/28/2017  The SEMI Foundation and the Micron Technology Foundation announced their partnership this week to deliver the 213th SEMI High Tech U (HTU) program which kicks off in earnest today at MicronÂ’s facilities in Milpitas.

ItÂ’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

EV Group optimizes resist and lithographic processing for plasma dicing

06/20/2017  EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers.

Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process

06/20/2017  Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET process technology.

ULVAC Technologies opens California office

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.