05/01/2006 NASA’s current space mission was designed to demonstrate that good things come in small packages - and part of its plan is to showcase the role MEMS can play in space.
05/01/2006 The term “cottage industry” usually evokes images of rural workers spinning textiles or hip urban geeks building Web sites in their loft apartments.
05/01/2006 Terry Devitt meant it as a joke. The director of research communications at the University of Wisconsin-Madison had asked UW chemistry professor Robert Hamers if he could make the school’s mascot, Bucky Badger, out of carbon nanofibers.
05/01/2006 Package-on-package (PoP) has emerged asthe preferred 3-D packaging solution for integration of logic and high-performance memory devices in mobile multimedia products.
05/01/2006 Indeed, there are hundreds and hundreds of storage system manufacturers. However, there are only a few whose products are compatible with the special needs inherent in a cleanroom environment.
05/01/2006 To those charged with establishing and maintaining the appropriate controlled environments for leading-edge semiconductor manufacturing, airborne molecular contam-ination (AMC) can appear to be a moving target.
05/01/2006 A typical phone call to a package manufacturer begins with: “I have this chip, what package do you have that will fit?” Next comes the basic questions: “What size is your chip? How many pads does it have? Does it need to be hermetic? Do you want it to be surface mountable? Leaded? Ball grid array? Oh, and by the way, how fast does your chip operate?” Depending on the answer to the last question, everything else becomes moot.
05/01/2006 Reactive bonding is a room-temperature process for soldering packages or components directly to boards without using a conventional solder reflow.
05/01/2006 The AKU2000 surface-mountable complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) microphone integrates an acoustic transducer, output amplifier, and 4th-order sigma-delta modulator in a single chip.
