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Opto-WLP Technology

05/01/2006  Wafer-level solutions for optical and sensor applications

IC and Package Co-design

05/01/2006  Dos and Don’ts of Wire-Bond Assembly

Gold Ball Bumping

05/01/2006  An Effective Wafer-Bumping Method

Pulsed-laser Heating for Flip Chip Assembly

05/01/2006  A stress-free alternative

Focus on Flip Chips

05/01/2006  Don’t you just love being right? It took a long time for flip chips to go mainstream, but now that they have made it, it’s very satisfying.

Advanced Packaging Hits the Road

05/01/2006  Advanced Packaging thought it was time for a fresh look at what’s really happening in the semiconductor packaging industry, so we’ve hit the road.

SMIC narrows losses in 1Q06, plans capex ramp

04/28/2006  April 28, 2006 - China's flagship foundry Semiconductor Manufacturing International Corp (SMIC) said it cut its net losses nearly in half to $8.7 million in 1Q06 from the previous quarter, on 5% higher revenues of $351.1 million.

IEST online education: Personnel in Cleanrooms

04/28/2006  April 25, 2006 -- /IEST/ -- ROLLING MEADOWS, Ill. -- The Institute of Environmental Sciences and Technology (IEST) continues to offer valuable online education classes.

Ecolab announces its Tsunami 100 product is the only EPA-registered antimicrobial water additive to reduce pathogens in fruit & vegetable process waters

04/28/2006  April 24, 2006 -- /BUSINESS WIRE/ -- ST. PAUL, Minn. -- Ecolab Inc. today announced that its Tsunami 100 product was recently registered by the U.S. Environmental Protection Agency to reduce 99.9 percent of pathogens in process waters used to clean fruits and vegetables.

Adept Robotics selected for Insulet's revolutionary OmniPod(TM) diabetes management system

04/28/2006  April 25, 2006 -- /BUSINESS WIRE/ -- LIVERMORE, Calif. -- Adept Technology, Inc. (NASDAQ:ADEP), the leading provider of intelligent vision-guided robotics and global robotics services, announced a major medical device automation program with Insulet Corporation for the OmniPod(TM) Insulet Management System, a disruptive technology for insulin delivery in diabetes management.

Recorded Webinar shares best-practice tips in conducting quality audit

04/28/2006  April 25, 2006 -- /MasterControl/ -- SALT LAKE CITY Utah -- Companies in FDA and ISO environments are required to conduct quality audit as a mechanism for continuous quality improvement and compliance.

First FDA clearance of sterile field cord blood collection bag

04/28/2006  April 25, 2006 -- EAST HILLS, N.Y. & CAMBRIDGE, Mass. -- ViaCell, Inc. (NASDAQ: VIAC) and Pall Corporation (NYSE: PLL) announced today the first U.S. Food and Drug Administration clearance of a cord blood collection bag suitable for use in a sterile field.

Pennsylvania Governor Rendell celebrates ribbon cutting for DuPont's new Bradford County manufacturing facility

04/28/2006  April 27, 2006 -- /PRNewswire/ -- NORTH TOWANDA TWP., Pa. -- Three years after announcing a $3 million investment to support DuPont's expansion in Bradford County, Governor Rendell today joined company officials and community leaders for a ribbon-cutting ceremony at the new 80,000-square-foot manufacturing facility.

Dow Corning's photonics and electronics partnership opens research center at Cambridge University

04/28/2006  April 24, 2006 -- /PRNewswire/ -- MIDLAND, Mich. -- Dow Corning Corporation, a member of the Centre for Advanced Photonics and Electronics (CAPE) consortium, today announced that Cambridge University Electrical Engineering Division has completed and equipped a new research facility for the development of emerging technologies across a variety of markets, including optoelectronics, nanoelectronics and displays.

Purdue touts MEMS on-chip microcooler

04/28/2006  April 28, 2006 - Scientists at Purdue U. have developed a MEMS-based micropump small enough to fit on a computer chip that circulates coolant through channels etched directly into the chip.

Taiwan Relaxing Chip Packaging Export Restrictions to China

04/28/2006  Taiwan has announced it is removing restrictions on export of low-end semiconductor packaging and testing technology to mainland China, according to an Associated Press report. The news suggests significant progress in revision of Taiwan policies regarding semiconductor manufacturing technology transfers between the island and mainland China, which expired at the end of 2005.
By James Montgomery, News Editor, Solid State Technology Magazine

Infineon, Elpida leapfrog in new DRAM ranks

04/28/2006  April 28, 2006 - A "blistering" 49% surge in revenues to $1.16 billion propelled Infineon Technologies AG to the No. 2 spot among DRAM manufacturers in 1Q06, the highest position ever for the German chipmaker, according to new data from iSuppli Corp.