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Report: Taiwan relaxing chip packaging export restrictions to China

04/27/2006  April 27, 2006 - Taiwan reportedly has removed restrictions on export of low-end semiconductor packaging and testing technology toChina, perhaps signaling a rethinking of broader restrictions on semiconductor manufacturing technology transfers to the mainland.

Pharma boosts pill power with nanoparticles

04/27/2006  Researchers are busily ferreting out new agents that make drugs more effective. For drug developers, it's a new avenue to explore in the quest to take a limited amount of vaccine and spread it among large populations fighting a potential pandemic.

TEL tips MEMS tester

04/26/2006  April 4, 2006 - Tokyo Electron Ltd. is offering a new wafer-level microelectromechanical system (MEMS) tester to help manufacturers isolate and validate electrical and mechanical functionality at the wafer level prior to packaging.

Nagase Acquires 60% Share of Pac Tech

04/26/2006  Nauen, Germany — Japan-based trading company Nagase and Co. acquired a 60% share of Pac Tech GmbH, an advanced laser bonding and bumping equipment provider, for an undisclosed amount on February 10, 2006.

Sidense, UMC qualify 90-65nm OTP cores

04/26/2006  April 26, 2006 - Sidense Corp., a fabless provider of one-time-programmable (OTP) memory IP, said its 1T-Fuse family of embedded OTP cores is slated to be silicon-verified in UMC's 90nm and 65nm process technologies

Elpida eyes 24% capacity ramp

04/26/2006  April 26, 2006 - Elpida Memory Inc. reportedly plans to raise production capacity at its 300mm site in Hiroshima, Japan, by about 24% from current levels to 67,000 wafers/month by fiscal 1Q07.

TSMC, UMC split fabless biz from MediaTek

04/26/2006  April 26, 2006 - Taiwan Semiconductor Manufacturing Co. reportedly has signed a contract to provide 0.13-micron manufacturing services to MediaTek Inc., Taiwan's top fabless house, for its LCD TV chips.

Cadence updates PCB design platform

04/26/2006  April 26, 2006 - Cadence Design Systems Inc., San Jose, CA, is extending its "segmented" product strategy to its system interconnect design platform, used for simplifying and streamlining designs for printed circuit boards.

Cadence, PDF to link DFM technologies

04/26/2006  April 26, 2006 -Cadence Design Systems Inc. and PDF Solutions Inc. say they will work together to develop design-for-manufacturability (DFM) technology aiming to improve IC manufacturability, yield, and reliability.

Nova buys ex-ATMI x-ray metrology biz

04/25/2006  April 25, 2006 - Nova Measuring Instruments Ltd., Rehovoth, Israel, has agreed to acquire former ATMI subsidiary HyperNex, a developer of x-ray diffraction metrology systems, for approximately $4.5 million.

Jazz Semi files again for IPO

04/25/2006  April 25, 2006 - Jazz Semiconductor Inc. has filed a registration statement with the SEC for a proposed $105 million initial public offering (IPO) of common stock, nearly a year after pulling its original -- and more ambitious -- IPO plans.