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Exploring smart sensor explosive growth at SEMICON West 2017

06/20/2017  MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

GLOBALFOUNDRIES, ON Semiconductor deliver the industry's lowest power Bluetooth low energy SoC family

06/19/2017  GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF's 55nm Low Power Extended (55LPx), RF-enabled process technology platform.

MagnaChip to offer 0.13 micron BCD process technology with high-density embedded flash

06/19/2017  This BCD process offers 40V power LDMOS and delivers 64K Bytes flash memory, making it suitable for programmable PMIC, wireless power chargers and USB-C power-delivery IC products.

Pixelligent Technologies named 2017 Manufacturer of the Year by Frost & Sullivan

06/19/2017  It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology.

To connect biology with electronics, be rigid, yet flexible

06/19/2017  Researchers uncover design principles to make polymers that can transport both ions and electrons.

Alloying materials of different structures offers new tool for controlling properties

06/19/2017  New research into the largely unstudied area of heterostructural alloys could lead to greater materials control and in turn better semiconductors, advances in nanotechnology for pharmaceuticals and improved metallic glasses for industrial applications.

New prospects for universal memory -- high speed of RAM and the capacity of flash

06/16/2017  Thin films created at MIPT could be the basis for future development of ReRAM.

Fast and precise surface measurement of back-grinding silicon wafers

06/16/2017  A new type of scattered light measurement method will be presented, capable of measuring the full wafer surface of a 300 mm wafer in less than 30 seconds. Besides the roughness, the sensor simultaneously measures warpage, waviness and defects.

North American semiconductor equipment industry posts May 2017 billings

06/16/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis)

Mechanistic modeling of silicon ALE for FinFETs

06/15/2017  The gate etch in a finFET process requires that 3D corners be accurately resolved to maintain a uniform gate length along the height of the fin. In so doing, the roughness of the etch surface and the exact etch depth per cycle (EPC) are not as critical as the ability of ALE to be resistant to aspect ratio dependent etching (ARDE).

HPC, chiplets and interposers

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

UMC restructures executive team

06/15/2017  UMC today announced that its board of directors has appointed senior vice presidents SC Chien and Jason Wang as co-presidents of the company, following Po-Wen YenÂ’s retirement as UMC CEO.

Samsung achieves 220 lumens per watt with new mid-power LED package

06/15/2017  Samsung Electronics Co., Ltd. today announced that it has begun mass producing a new mid-power LED package, the LM301B, which features the industry's highest luminous efficacy of 220 lumens per watt.

Development of low-dimensional nanomaterials could revolutionize future technologies

06/15/2017  Javier Vela, scientist at the US Department of Energy's Ames Laboratory, believes improvements in computer processors, TV displays and solar cells will come from scientific advancements in the synthesis of low-dimensional nanomaterials.

7 of the top 10 smartphone suppliers headquartered in China

06/15/2017  China accounted for 10 of top 14 leading smartphone suppliers in 2016, share grows to 39%.

GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.