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Report: Optoelectronics demand soaring past discretes

03/30/2006  March 30, 2006 - For the first time ever, the optoelectronics market is expected to surpass the discrete semiconductor segment this year to become the second largest market segment in the semiconductor industry behind ICs, according to a new report from IC Insights Inc., Scottsdale, AZ.

SUSS Installs Probe Systems in IMEC Research Center

03/30/2006  Munich, Germany — SUSS MicroTec AG has installed PA300PS ProbeShield semiautomatic probe systems with ReAlign and ContactView technology and PA300 probe systems for RF-noise and S-parameter measurements at IMEC, a Leuven, Belgium-based nanoelectronics research center. The two companies will also collaborate on enhancing 300-mm probe systems in the future.

SEMATECH tips materials for nMOS metal-gate electrodes

03/30/2006  March 30, 2006 - SEMATECH says it has identified metal electrode materials for use with nMOS transistors with high-k dielectric, a big step on the way toward fabricating working CMOS devices using metal gate and high-k dielectric stacks.

Alliance trio lines up DFM support for 65nm process

03/30/2006  March 30, 2006 - Chartered Semiconductor Manufacturing Ltd., IBM Corp., and Samsung Electronics Co. Ltd. have announced availability of design-for-manufacturing (DFM) technology, models, design kits, and data files for their common 65nm process technology platform.

Legal corner: how to minimize risk of losing patent rights

03/30/2006  Often a patent attorney will advise that a patent application be filed before the invention is publicized, used in public, or offered for sale.

Companies partner on automotive sensor development

03/30/2006  Methode Electronics International GmbH, a division of Methode Electronics Inc., a global developer and manufacturer of electronic component and subsystem devices, and SensorDynamics AG, a development company manufacturing intricate microchip and micro-sensor systems, announced that they have signed a long-term collaboration agreement.

Microbonds, Tanaka ink bonder deal

03/29/2006  March 28, 2006 - Privately held Canadian interconnect developer Microbonds Inc. has licensed its "X-Wire" gold wire bonding technology for use in Tanaka Denshi Kogyo's line of gold bonding wire products.

Foundries slip in 2005—some more than others

03/29/2006  March 29, 2006 - For the first time in memory, foundry segment revenue growth lagged behind that of the overall semiconductor industry in 2005, according to preliminary data from Gartner Dataquest.

Cookson Earns Three Business Management Certificates from BSI

03/29/2006  Jersey City, NJ — Cookson Electronics' Shenzhen, China site recently earned three Business Management Certificates from the British Standards Institution (BSI) due to their performance in meeting stringent standards for the company's Quality Management System (QMS) ISO 9001:2000, Environmental Management System (EMS) ISO 14001:2004, and Occupational Health & Safety Assessment Series OHSAS:18001 standards.
By Lee Mather, assistant editor

Report: Taiwan IC sector to rebound in 2006

03/29/2006  March 28, 2006 - Revenue from Taiwan's IC industry rose 1.7% in 2005 to NT$1.12 trillion (US $34.34 billion), well below the total global industry's ~7% growth for the year, but is seen rebouding to 16% growth in 2006.

SEZ Ships Multiple Single-wafer Tools to Amkor in Asia-Pacific

03/28/2006  Shanghai, China — The SEZ Group is shipping multiple 2- and 4-chamber 300-mm Spin Processor systems to Amkor Technology as part of a follow-on order. The tools will be used for under-bump metallization (UBM) etch and photoresist strip for advanced packaging applications at Amkor subsidiary Unitive Semiconductor Taiwan (UST), as well as in their copy-exact line in Singapore.

iSuppli dips memory outlook, but still positive about 2006

03/28/2006  March 28, 2006 - New forecast data from iSuppli Corp. indicates concerns over NAND flash memory demand, but continued optimism for DRAM sales and the memory market overall.

Veeco unveils new scanning probe scopes

03/28/2006  Veeco, a supplier of instrumentation to the research and nanoscience community, announced the launch of two new scanning probe microscope (SPM) products, the MultiMode V SPM and the Dimension V SPM for both research and industrial applications.

Toshiba claims victory over Hynix in NAND flash dispute

03/27/2006  March 27, 2006 - A Japanese court reportedly has ruled in favor of Toshiba Corp. in its NAND flash patent infringement suit against South Korean competitor Hynix Semiconductor Inc.

DNS spending $250M for chip, LCD increases

03/27/2006  March 27, 2006 - Dainippon Screen Mfg. Co. (DNS) is planning to double its investments to 30 billion yen (about US $256.2 million) over the next three years, to increase capacity for semiconductor and LCD glass substrate manufacturing equipment.

Liposome researchers seek to stop bird flu before it takes flight

03/27/2006  A small band of researchers scattered around the country from East Tennessee State University to Harvard's Brigham and Women's Hospital are about to test a new, nanotech approach to heading off a potential bird flu pandemic. The scientists are developing liposomes, fatty globules used as a tiny drug delivery device, which contain a mix of antioxidants and anti-viral drugs.

Ablynx names new CEO

03/27/2006