03/24/2006 March 24, 2006 - AmberWave Systems Corp., Salem, NH, a developer of IP relating to strained silicon and other advanced materials, and Purdue U. have agreed to jointly develop technologies for integrating semiconductor devices on III-V materials.
03/24/2006 March 24, 2006 - Furnaceware provider Integrated Materials Inc., Sunnyvale, CA, has unveiled a new suite of tools for vertical furnace processes that it says offer performance than quartz and silicon carbide consumables.
03/24/2006 March 24, 2006 - Three executives of Samsung are the latest to be punished for their roles in a DRAM price-fixing conspiracy, according to the US Justice Department.
03/24/2006 March 24, 2006 - IBM Corp. has built the first complete electronic IC around a single carbon nanotube molecule using standard semiconductor processes, an achievement that could simplify future manufacturing and consistency of such devices.
03/24/2006 The circuit was built using standard types of semiconductor processes, according to IBM. It uses a single carbon nanotube molecule as the base for the other components in the circuit.
03/23/2006 March 23, 2006 - Rudolph Technologies Inc., Flanders, NJ, is rolling out a second-generation replacement for August Technology's E20 wafer edge inspection system, to provide edge inspection for CMP, etch, clean, deposition, pre-RTP and final QA processes.
03/22/2006 Herndon, VA — Registration for the International Electronics Manufacturing Initiative (iNEMI)'s 2007 Roadmap workshop, to be held together with SEMICON Europa in Munich, Germany, on April 5th, closes on March 28, 2006, barring full capacity prior to the date. The full-day meeting will give attendees a first-look at draft chapters of the 2007 Roadmap, including two key market segments and eight technology and infrastructure areas the Roadmap covers.
03/22/2006 March 22, 2006 - Intel Corp. has handed out its annual awards to more than three dozen suppliers from its roster of thousands of supply-chain partners, ranging from capital equipment manufacturers to materials, components, and service providers.
03/22/2006 March 22, 2006 - Demand for semiconductor manufacturing equipment from North American-based suppliers continued slow but steady growth in February, with the market showing orders outweighing sales for the first time since mid-2004, according to new data from SEMI.
03/22/2006 As MEMS-based products make their way into the consumer electronics market, one promising application is a device a reviewer dubbed the "remote control bagel."
03/21/2006 March 21, 2006 - Entegris Inc., Chaska, MN, is investing $5.2 million to nearly double manufacturing capacity at its facility in Kulim, Malaysia, to prepare for an anticipated upswing in the region that produces more than half of its revenues.
03/21/2006 Scotts Valley, CA — Carsem recently received Microsemi Corp.'s Integrated Products Group's Supplier of The Year Award for 2005 in the Assembly and Test category, which derives its criteria from on-time delivery, yield, customer service, quality, competitiveness, responsiveness, and technology ratings in an exacting supplier rating program.
03/21/2006 San Jose, CA — Worldwide semiconductor manufacturing equipment sales totaled $32.88 billion in 2005, which shows an 11% drop year-over-year, claims the new Worldwide Semiconductor Equipment Market Statistics (SEMS) Report, compiled by SEMI members and the Semiconductor Equipment Association of Japan (SEAJ).
03/21/2006 March 21, 2006 - Rambus Inc. has signed what it calls its "first system-level patent license" with Fujitsu Ltd., a wide-ranging and potentially lucrative deal spanning all of Fujitsu's business.
03/21/2006 March 21, 2006 - Worldwide sales of semiconductor manufacturing equipment dipped 11% in 2005 following significant expansion in 2004, but it was still the third-strongest year in history for suppliers overall, according to new data from SEMI.
