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Buyer beware: Product list highlights both nanotech and nano-marketing

03/16/2006  For now, consumers are likely to experience nanotech in pedestrian ways – perhaps by chewing chocolate-flavored gum or buying diamonds cultured in labs, not mined from the Earth. Those are among hundreds of available consumer products being spawned as companies manipulate matter at the atomic level.

Stencil Workshops Touch Upon Wafer Printing, BGA Ball Placement

03/15/2006  Colorado Springs, CO — Photo Stencil's upcoming 2006 workshops will provide information on stencil printing performance and how stencil technology and stencil design each impact this performance. Data generated by independent test laboratories during print performance studies, along with Photo Stencil's Dr. Bill Coleman, vice president of technology, and Mike Burgess, stencil product manager, will come together to offer pertinent information.

Korea proposes tariff negotiations with Japan

03/15/2006  March 15, 2006 - South Korea has asked to sit down with Japanese officials to discuss a move to levy countervailing duties on DRAM memory chips, possibly a prelude to pushing the World Trade Organization for a ruling on the dispute.

ChipMOS frontloading capex for Spansion, staying cautious

03/15/2006  March 15, 2006 - ChipMOS Technologies Ltd. posted a profit of $14.5 million on revenues of $130.4 million in 4Q05, up from a $3.2 million profit and $112.0 million in sales in the same period a year ago.

Practical Components Grows Offering with PoP Drop-test Board and Kit

03/15/2006  Los Alamitos, CA — Practical Components, an international mechanical IC samples and SMD production tools and equipment distributor, has added Amkor Technology's package-on-package (PoP) lead-free test board and kit to its offering. The lead-free drop-test kit and board acts as a test vehicle for Amkor's new PSvfBGA 14 × 14-mm, 353-ball PoP base package with a 14 × 14-mm, 152-ball top package.

Analyst: No downturn coming, despite high utilization rates

03/14/2006  March 14, 2006 - Despite current near-maximum capacity utilization rates comparable with or even above previous cyclical tipping points, a similar downturn is likely not in store in the near-term for the semiconductor industry, according to analyst firm Advanced Forecasting.

Samsung ramps 80nm DDR2 memory

03/14/2006  March 14, 2006 - Samsung Electronics Co. Ltd. has ramped to volume production of its 512Mb DDR2 DRAM using 80nm process technologies.

Rudolph Wraps Up Multiple Tool Order

03/14/2006  Flanders, NJ — Rudolph Technologies Inc. has completed a multiple system sale to a Taiwan-based memory solutions provider. The original order, which wrapped in the second half of 2005, included multiple WaferView macrodefect inspection systems and a YieldView data management system, but a repeat order for a WaferView system will be delivered this month.

Sensor System Solutions signs agreement with X-Labs Global

03/14/2006  Sensor System Solutions Inc., a manufacturer of MEMS sensors, intelligent sensor interface electronics and intelligent embedded control systems, announced it has signed an agreement with X-Labs Global, a technology advisory and consulting firm based in Los Angeles.

West Coast institutes form nano center

03/13/2006  March 13, 2006 - Four schools in California have joined to establish the Western Institute for Nanoelectronics in an effort to explore spintronics as a possible alternative to silicon CMOS for semiconductor devices beyond the 65nm node.

SUSS MicroTec, Instrument Systems Form Test System Partnership

03/13/2006  Munich, Germany — SUSS MicroTec and Instrument Systems have formed a strategic partnership to develop a next-generation, high-throughput test system for LED devices at wafer-level that tests up to 70,000 LED dies per hour.

Wilson Center unveils nano product list

03/10/2006  The Project on Emerging Nanotechnologies at the Woodrow Wilson International Center for Scholars today launched a nanotechnology consumer products inventory.