06/14/2017 Today SEMI announced that the two-day Strategic Materials Conference (SMC) is slated for September 19-20 at San Jose's Doubletree by Hilton Hotel.
06/14/2017 Queen's University Belfast researchers have discovered a new way to create extremely thin electrically conducting sheets, which could revolutionise the tiny electronic devices that control everything from smart phones to banking and medical technology.
06/14/2017 Osram Opto Semiconductors today presented the latest generation of surface-mountable LED, the Topled E1608, with a package smaller than its predecessor models by a factor of 20.
06/13/2017 Silicon Integration Initiative Inc. announced today the contribution of a new integrated circuit programming language developed by Intel Corporation for the 2D pattern analysis of sub-20nm mask layouts.
06/13/2017 A multi-institutional team led by the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) discovered a way to create new alloys that could form the basis of next-generation semiconductors.
06/12/2017 With consumers already accustomed with using smartphones and tablet PCs in their everyday lives, touch screens are now increasingly making their way into their vehicles, too.
06/12/2017 The State University of New York ranked 38th in the “Top 100 Worldwide Universities Granted U.S. Utility Patents for 2016,” according to the National Academy of Inventors (NAI) and Intellectual Property Owners Association (IPO).
06/12/2017 The new system employs a network of electronic oscillators to solve graph coloring tasks – a type of problem that tends to choke modern computers.
06/12/2017 Cypress Semiconductor Corporation announced that Executive Chairman Ray Bingham has tendered his resignation as Executive Chairman and is stepping down from the Board of Directors.
06/09/2017 Dow Corning today introduced Dow Corning CL-1000 Optical Silicone Binder, a new, more thermally stable, high refractive index (RI) material available only in China that is formulated to expand design options for high-power chip-scale LED packaging (CSP).
06/09/2017 A research team led by Iowa State University's Zhe Fei has made the first images of half-light, half-matter quasiparticles called exciton-polaritons. The discovery could be an early step to developing nanophotonic circuits that are up to 1 million times faster than current electrical circuits.
06/09/2017 UPV/EHU-University of the Basque Country's researchers have explored superelasticity properties on a nanometric scale based on shearing an alloy's pillars down to nanometric size.
06/08/2017 Imec is wrapping up at the Symposia on VLSI Technology this week with two announcements: the reporting of record breaking values below 10^-9 Ohm.cm² for PMOS source/drain contact resistivity and new process improvements for next generation devices.
