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03/01/2006  This July, delegates to an international conference will meet in Geneva, Switzerland, to consider recommendations aimed at improving the risk governance of nanotechnology.

03/01/2006  Startup expects to sign deals for Loop, navigation system

03/01/2006  It’s official - the nanos are coming. While not yet battering our packaging gates, they are within sight of our walls, and advancing rapidly.

03/01/2006  Studies fail to include basics for assessing toxicity

03/01/2006  A few days after Intel’s announcement, Freescale Semiconductor (Austin, TX) stated it had solved the problem of building metal oxide semiconductor field effect transistor (MOSFET) devices in gallium arsenide (GaAs)-an innovation that could mean new uses for GaAs, since GaAs MOSFETs should be faster than their similarly sized silicon counterparts.

03/01/2006  The latest contamination-control innovations and inventions

03/01/2006  Throughout the electronics community, the accepted assumption is that packaging will save the industry.

03/01/2006  There’s a lot of talk in the electronics industry about the blurred lines between advanced packaging (AP) and surface mount technology (SMT), and nowhere was that more apparent than on the trade show floor at the IPC Printed Circuits Expo, APEX, and the Designers Summit, held February 7-10, 2006, at the Anaheim Convention Center in Anaheim, CA.

03/01/2006  When considering cleaning lead-free residues, what needs to be asked first: must I, should I, can I, can I afford to, or can I afford not to?

03/01/2006  Ceramics’ unique properties such as low loss factor, high thermal stability, and hermeticity have secured their role for applications in RF, high-temperature, and high-reliability devices for decades.

03/01/2006  Various flip chip systems have been used for advanced packages, including chip scale packages (CSPs) and ball grid arrays (BGAs).

03/01/2006  Until recently, micro-systems technology resonant-mode inertial measurement units (IMUs) have had limited lifetime.

03/01/2006  Keeping up with electrical and mechanical requirements

03/01/2006  METROLOGY TOOLS PROVIDE SOLUTIONS

03/01/2006  An option for device-stacking applications

03/01/2006  Reduces Time-to-Market

03/01/2006  Expanding New Applications Development

02/28/2006  MEPTEC Symposium Wrapup
By Julia Goldstein, Ph.D., Advanced Packaging contributing editor
Thermal management continues to be a "hot" area, and MEPTEC's second annual "The Heat is On" symposium on February 16^th packed the hall despite the plethora of events covering the topic.
(February 28, 2006)

02/28/2006  Hong Kong and Pleasanton, CA — ASAT Holdings Limited anticipates transferring all of its manufacturing operations to its new facility in Dongguan, China by the end of April 2006 — about 4 months ahead of schedule. The single manufacturing facility will have a much leaner cost structure, claims the company in a statement.

02/28/2006