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The audio world has stepped into another dimension

06/07/2017  Market for MEMS microphones and ECMs, micro-speakers and audio ICs will be worth US$20 billion in 2022.

Global semiconductor sales increase 21% year-to-year in April

06/07/2017  Double-digit annual growth projected for 2017.

Imec demonstrates breakthrough in CMOS-compatible ferroelectric memory

06/07/2017  Imec has proved the validity of ferroelectric memory as a promising technology at various points in the memory hierarchy, and as a new technology for storage class memory -- today, it demonstrated the world's first a vertically stacked ferroelectric Al doped HfO2 device for NAND applications.

SIA welcomes DARPA initiative to advance transformative semiconductor technologies

06/06/2017  New program aims to progress beyond traditional scaling, catalyze next-generation semiconductor technologies.

SEMI reports record quarterly billings of $13.1B

06/06/2017  The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record.

AMOLED TV panel shipments to top 10 million units by 2023

06/06/2017  As panel makers are increasingly targeting the premium TV market, active-matrix organic light-emitting diode TV panel shipments are expected to exceed 10 million units by 2023, growing at a compound annual growth rate (CAGR) of 42 percent from 2017.

New diode features optically controlled capacitance

06/06/2017  Israeli researchers have developed a new optically tunable capacitor with embedded metal nanoparticles, creating a metal-insulator-semiconductor diode that is tunable by illumination.

Air Products invests in six industrial gas plants to support electronics manufacturing industry in China

06/05/2017  Air Products announced it has recently received multiple, long-term supply awards from semiconductor and flat panel display manufacturers in China as the country's electronics manufacturing industry continues to boom.

Mentor OSAT Alliance program streamlines IC high-density advanced packaging design and manufacturing

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

Engineer unveils new spin on future of transistors with novel design

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

Seeing the invisible with a graphene-CMOS integrated device

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.

Model for 2-D materials based RRAM found

06/02/2017  The group lead by Prof. Mario Lanza develops a resistive random access memory device using only 2-D materials (graphene electrodes and hexagonal boron nitride insulators), and develop a complete theoretical model to describe its functioning.

Queen's researcher's 'miracle material' discovery could end cracked smart devices

06/02/2017  A Queen's University researcher has led an international team of scientists to the discovery of a new material, which could finally bring an end to the misery of cracked smartphone and tablet screens.

New method of characterizing graphene

06/01/2017  Scientists have developed a new method of characterizing graphene's properties without applying disruptive electrical contacts, allowing them to investigate both the resistance and quantum capacitance of graphene and other two-dimensional materials. Researchers from the Swiss Nanoscience Institute and the University of Basel's Department of Physics reported their findings in the journal Physical Review Applied.

"Billion Dollar Capex Club" forecast to swell to 15 companies in 2017

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A ManufacturerÂ’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factoriesÂ’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but MicrosoftÂ’s Sanjay Ravi explained in Wednesday morningÂ’s keynote that this innovation is becoming available now to manufacturers.