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Beleaguered Philips places its chips on nanowires

02/01/2006  Despite changes afoot at their troubled semiconductor division, researchers at Dutch multinational Philips Electronics continue to develop technology that will enable the next generation of chips. They are among a handful of companies using nanoscale components to make transistors ever smaller. "Historically the semiconductor roadmap has always been about more Moore," said Ronald Wolf, group leader at Philips Research.

Cooperating with Nature

02/01/2006  I’ve always thought capitalism worked well in the world economy because it aligned perfectly with human nature.

Reusable Cleanroom Garments, Part 1

02/01/2006  In the December issue of CleanRooms, this column focused on the use of disposable garments.

Collaboration to manufacture high-sensitivity biosensors for food and clinical samples

02/01/2006  A new mass-detection system utilizing microelectromechanical systems (MEMS) and a unique resonating sensor is being developed by a collaboration of academic, industrial and government groups, and initially promises several performance improvements over existing technologies in the detection of foodborne pathogens, infectious diseases and cancer.

Faster ID for flu strains

02/01/2006  CombiMatrix Corp. has produced a CMOS chip for the timely identification of influenza strains.

Measuring 3-D Semiconductor Packages

02/01/2006  Meeting the Challenge

3-D-stacked ICs with Copper Nails

02/01/2006  Allows System Size Reduction

Advances in Metal Deposition for Wafer Bumping

02/01/2006  Increasing Complexity and Functionality of Packages

Ingenious Assembly of Micro-optical Components

02/01/2006  New manufacturing methods

Honey, I Shrunk the Process Window

02/01/2006  With the electronics industry making its move to lead-free manufacturing, attention is focused on solder.

Application of Industrial Inkjet Technology to Packaging

02/01/2006  Piezoelectric inkjet technology has advanced to become a key enabler for the digital revolution in manufacturing, and will transform analog production processes just as digital technology replaced analog in telecommunications.

SEMICON China 2006

02/01/2006 

OEM Strategy: Buy, Build, or Partner?

02/01/2006  The term “Original Equipment Manufacturer” (OEM) was coined when most companies in the electronics industry designed, developed, and manufactured nearly everything in their end products.

The IC Package

02/01/2006  Missing Link between Nanometer Silicon and Multi-gigabit PCB systems

High-Performance Thermal Management Materials

02/01/2006  Crucial for future packaging

New gage paint technology saves automakers money

02/01/2006  January 30, 2006 -- /PRNewswire/ -- FERNDALE, Mich. -- An advanced automotive paint technology system designed to help automakers save money and increase efficiency has been developed at Gage Products Company, a global leader in closed-loop recycling processes for automotive paint solvents.

New ISMI program to explore transition to 450 mm manufacturing

02/01/2006  January 30, 2006 -- /MARKET WIRE/ -- AUSTIN, TX -- The International SEMATECH Manufacturing Initiative (ISMI) has begun a program to explore critical issues and barriers to introducing a new wafer size for manufacturing in the semiconductor industry, consortium officials said today.

IEST offers valuable online education classes

02/01/2006  January 31, 2006 -- /IEST/ -- ROLLING MEADOWS, IL -- The Institute of Environmental Sciences and Technology (IEST) continues to offer valuable online education classes in its "Access the Experts" series.