01/27/2006 January 27, 2006 - Singapore foundry Chartered Semiconductor Manufacturing Ltd. posted a profit of $26.5 million on sales of $367.2 million, vs. a loss of $26.8 million on sales of $190.6 million a year ago.
01/27/2006 January 27, 2006 - In an move to return to profitability for all of its frontend segments, ASM International NV, Bilthoven, The Netherlands, said that it will scale back its NuTool operation to license the technology, and consolidate its wafer-handling platforms.
01/27/2006 January 27, 2006 - Xtreme Technologies GmbH, a joint venture between Jenoptik AG and Ushio Inc. developing light sources for extreme-ultraviolet (EUV) photolithography, has received an undisclosed amount of funding from Intel Corp.'s investment arm to accelerate development and commercialization of the technology.
01/27/2006 San Jose, CA — SV Probe, a supplier of high-performance probe cards, signed an agreement to purchase the assets of Kulicke and Soffa Industries, Inc.'s (K&S) wafer test business for $10 million. With the acquisition, SV Probe aims to provide continuous service and supply to K&S' existing customer base for blade, cantilever, vertical, and advanced-vertical probe card products and wafer interface products.
01/26/2006 January 26, 2006 - In a move to return focus to its core assembly business, Kulicke & Soffa Industries Inc., Willow Grove, PA, has agreed to sell assets and IP of its wafer test and package test businesses.
01/26/2006 January 26, 2006 - Nanometrics Inc., Milpitas, CA, is acquiring Accent Optical Technologies Inc., Bend, OR, in a stock deal worth approximately $80.9 million in a deal that combines Nanometrics' and Accent's process control and metrology technologies.
01/26/2006 January 26, 2006 -- /MARKET WIRE/ -- AUSTIN, Texas -- Texas-based Nano-Proprietary, Inc. (OTC BB: NNPP), through its subsidiary, Applied Nanotech, Inc. (ANI), today announced that it will receive $1 million for further development of its PhotoScrub(tm) concept.
01/26/2006 January 25, 2006 -- /PRNewswire/ -- STREETSBORO, Ohio -- Automated Packaging Systems, the world leader in high-reliability packaging systems, has introduced the FAS SPrint SidePouch(TM) Bagging System.
01/26/2006 January 25, 2006 -- /PRNewswire-FirstCall/ -- FREMONT, Calif. -- Mattson Technology, Inc. today announced the shipment of its Aspen III eHighlands low-k/copper strip system to DongbuAnam Semiconductor, Korea's largest pure-play foundry.
01/26/2006 The combination of Nanometrics and Accent would create one of the largest metrology and process control companies in the semiconductor capital equipment industry. Based on the closing price of Nanometrics common stock on Wednesday, the transaction values Accent at $80.9 million.
01/26/2006 XTREME Technologies GmbH, based in Gottingen and Jena, Germany, announced it has received funding from Intel Capital, Intel Corp.'s strategic investment arm, to accelerate development of its extreme ultraviolet light source for photolithography applications.
01/25/2006 January 25, 2005 - Edmund Optics Inc., Barrington, NJ, has unveiled an illumination delivery technology to increasing illumination brightness in LEDs as well as their lifetimes.
01/25/2006 January 24, 2006 -- Clinton Township, Mich. -- KUKA Robotics Corporation, a leading global manufacturer of industrial robots, today announced its system partner, Forte Automation Systems, has installed a KUKA KR 15 SL stainless steel robot into Dean Foods' dairy product manufacturing facility.
01/25/2006 January 24, 2006 -- /IEST/ -- The Institute of Environmental Sciences and Technology (IEST) announces the unveiling of the virtual expo and online advance program for ESTECH 2006, the 52nd annual technical meeting and exposition at the Hyatt Regency Phoenix in Phoenix, Arizona, May 7-10, 2006.
01/25/2006 San Jose, CA — The Semiconductor Industry Association (SIA) has appointed W. Patrick Wilson, a veteran Capitol Hill staffer, as director of Government Affairs for the association that represents the U.S. semiconductor industry. Based in Washington, Wilson will lead the U.S. chip industry's interactions with both Congress and the Administration.
