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EV Group expands production capacity at corporate headquarters in Austria

05/31/2017  EV Group (EVG) announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria.

Imec and Cascade Microtech develop first automatic probe system for advanced 3D chips

05/31/2017  Imec and Cascade announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.

OEM Group expands P5000 capabilities to compound semiconductor substrates

05/25/2017  OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market.

SEMICON West preview: MEMS

05/23/2017  Autonomous automobiles, smart manufacturing, smart buildings, mobile human health monitoring, and 4G+ communications hardware for connecting all these devices will drive strong 24 percent growth in units and 14 percent in value for the MEMS sector.

IEEE International Electron Devices Meeting announces 2017 Call for Papers

05/23/2017  The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held at the Hilton San Francisco Union Square hotel December 2-6, 2017, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

North American semiconductor equipment industry posts April 2017 billings

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

GLOBALFOUNDRIES and Chengdu partner to expand FD-SOI ecosystem in China

05/23/2017  GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China's semiconductor industry.

Amkor Technology completes acquisition of NANIUM

05/22/2017  Amkor Technology, Inc. today announced that it has completed the acquisition of NANIUM S.A., a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

Technology partners at SEMICON West focus on innovations driving industry growth

05/22/2017  SEMI today announced its plans to deliver specialized programs at SEMICON West 2017 (July 11-13 at Moscone Center in San Francisco, Calif.) in partnership with IEEE (Institute of Electrical and Electronics Engineers), Society of Automotive Engineers International (SAE), and imec.

Engaging diamond for next-era transistors

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

Sensor/actuator sales take off as price erosion eases

05/22/2017  Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

EV Group announces milestone: More than 1100 wafer bond chambers installed worldwide

05/22/2017  Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors.

Learn the Basics of Power Amplifier and Front End Module Measurements

05/22/2017  The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.

Lam Research appoints Dr. Y.B. Koh to Board of Directors

05/15/2017  Lam Research today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017.

Next-gen solar cells could be improved by atomic-scale redesign

05/15/2017  Researchers have uncovered the exact mechanism that causes new solar cells to break down in air, paving the way for a solution.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

ON Semiconductor wins Gold Stevie American Business Award for Large Manufacturing Company of the Year

05/15/2017  ON Semiconductor Corporation announced that it is has been named the winner of the Gold Stevie Award for Large Manufacturing Company of the Year in The 15th Annual American Business Awards (ABAs).

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors