Featured Content




Total facility cleanliness

12/01/2005  How preventative cleaning measures outside of your cleanroom will boost sanitation levels on the inside

Solder Bumping Single Die

12/01/2005  Although computers and simulation software have accelerated product development, most electronic products eventually reach the traditional developmental stages of prototypes and samples.

Looking Forward

12/01/2005  In the month of December, as one year nears its close, I begin to think about where the world of advanced packaging has been and will go.

Advances in 3-D Electronics

12/01/2005  The earliest electrical circuits appeared to be 3-D; discrete wires interconnecting circuit elements in 3 dimensions.

The Inspection Connection 2

12/01/2005  Latest Technologies in Optical Inspection

High-definition X-ray Inspection

12/01/2005  Understanding the uses and limitations

Investigating Electronics Cooling Technologies

12/01/2005  An alternative to pure thermals

Probe Cards Enable Wafer-level Test

12/01/2005  Reducing Cost of Test

Marking Electronics Products and Packages

12/01/2005  Choosing the Right Method

Solder Bumping for Emerging Wafer-level Packages

12/01/2005  Expanding Technologies Match Demand

Wafer-level Processes are Going Backwards-compatible

12/01/2005  Whichever way you read the data or interpret the signs, modern product lifecycles are diminishing quickly enough to stretch the limits of feasibility.

Tessera's Senior VP and CFO Announces Retirement

11/30/2005  San Jose, CA — Tessera Technologies' senior VP and CTO, R. Douglas Norby, has informed the company of his plans to retire, and will remain in his position until Tessera names a successor. A search for Norby's replacement is currently underway.

Cookson Nabs Patent for Stencil Software

11/30/2005  Jersey City, NJ — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design, and ordering software, effective August 30, 2005.

IEEE working on carbon nanotube standard

11/30/2005  Institute of Electrical and Electronics Engineers (IEEE) announced it has begun work on a new standard, "Standard Methods for the Characterization of Carbon Nanotubes Used as Additives in Bulk Materials". Known as IEEE P1690, the standard is expected to be the first to define methods for testing carbon nanotube additives and how to report the resulting performance data.

December 2005 Exclusive Feature: COMPOUND SEMICONDUCTORS

Using AFM to enhance MOCVD-grown OE devices



11/29/2005  Doru I. Florescu, Veeco Instruments Inc.

Metal-organic chemical-vapor deposition has steadily progressed from small-scale materials research to a mass production technology, enabling such complex optoelectronic devices as laser diodes and ultrahigh-brightness light-emitting diodes...

Samsung generates largest high-res flexible LCD

11/28/2005  November 28, 2005 -- Samsung Electronics Co. Ltd., Seoul, Korea, has reportedly manufactured the largest flexible thin-film transistor liquid-crystal display (TFT-LCD) that shows high enough resolution for digital television.

Freescale manufactures 24Mbit nanocrystal memory

11/28/2005  November 28, 2005 -- Freescale Semiconductor, Austin, TX, has brought silicon nanocrystal memory technology a little closer to commercial reality. The company reports that it has produced a 24Mbit memory array based on Si nanocrystals, a denser, faster, nonvolatile option that may take the place of floating gate-based flash memories, due to the expectation that conventional embedded flash memory technology may reach its scaling limits within four years.