05/12/2017 Racyics GmbH announced today it has launched makeChip, an design service platform, developed using GLOBALFOUNDRIES' 22FDX process technology and supported by Cadence.
05/12/2017 Renesas Electronics Corporation announced it will consolidate its subsidiary Renesas System Design, Co., Ltd. through an absorption-type merger.
05/12/2017 As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust -- currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields.
05/11/2017 Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company's future growth plans.
05/11/2017 Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.
05/10/2017 Semiconductor Manufacturing International Corporation announces the appointment of Dr. Haijun Zhao as CEO replacing Dr. Tzu-Yin Chiu, who will continue to serve as Vice Chairman and Non-Executive Director of the Board and guide the Company's future strategic direction.
05/10/2017 SEMI today announced that SEMICON West (July 11-13 in San Francisco, Calif.) experience packages are now available for purchase, allowing attendees to choose the programs and events most relevant to their interests.
05/10/2017 Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.
05/09/2017 UnitySC today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform.
05/09/2017 Graphene is considered as one of the most promising new materials. However, the systematic insertion of chemically bound atoms and molecules to control its properties is still a major challenge. Now, for the first time, scientists of the Friedrich-Alexander-Universität Erlangen-Nürnberg, the University of Vienna, the Freie Universität Berlin and the University Yachay Tech in Ecuador succeeded in precisely verifying the spectral fingerprint of such compounds in both theory and experiment.
05/08/2017 Orbotech Ltd. announced today that Tianma Micro-electronics Co. Ltd. has selected Orbotech's ArrayChecker and Automated Optical Inspection (AOI) solutions for its production line upgrade to flexible AMOLED technology.
05/08/2017 SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it has raised $8.5 million in a Series B round led by Spark Capital with participation from Osage University Partners and existing investor Sutter Hill Ventures.
05/08/2017 No more error-prone evaporation deposition, drop casting or printing: Scientists at Ludwig-Maximilians-Universitaet (LMU) in Munich and FSU Jena have developed organic semiconductor nanosheets, which can easily be removed from a growth substrate and placed on other substrates.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
