Featured Content




The flip side of nanotech contamination control

11/01/2005  Although it may not be immediately apparent to everyone, contamination control has certainly been in the news a lot recently.

IEST-RP-CC006.3: Testing Cleanrooms

11/01/2005  The principal purpose of testing cleanrooms and clean zones is to determine operational performance.

Thermally Enhanced, Next-generation 3-D Power Packages

11/01/2005  A Heat-Management Solution

Hurricane Katrina: A tragic case study in contamination prevention, control and remediation

11/01/2005  Recently an acquaintance of mine sent me a series of spectacular photographs of hurricane Katrina as it edged along its somewhat indiscriminate yet determined route, making landfall at several locations along the way.

The importance of gloves

11/01/2005  Cleanroom operators around the world will spend close to $1 billion for gloves this year.

Building the future into biopharmaceutical facility design

11/01/2005  Involve your manufacturing team in the planning process, sweat the details, and get smart about how your cleanroom functions

Material handling trends in semiconductor cleanrooms

11/01/2005  Semiconductor manufacturing and cleanroom use have been tightly coupled since the earliest days; today, semiconductor cleanrooms continue to drive trends and technology.

A Bumpy Trip for Solder Bumping

11/01/2005  A recent study projects a major shift in the relative market shares of the most common solder bumping methods.

Solder Bumping

11/01/2005  Mastering Challenges of Lead-free Alloys

RFID Chip Assembly for 0.1 Cent?

11/01/2005  Future possibilities for RFID development

Lead-free WLCSP Qualification

11/01/2005  A Consumer Electronics Case Study

IC Sockets:

11/01/2005  A Critical Role in Back-end ATE Testing

Private Moments

11/01/2005  There are times when we get so caught up in the news, natural emergencies, and keeping up with the latest technological whiz-bangs that we lose perspective.

Automating IC Package Design

11/01/2005  With advances in semiconductor fabrication driving into the nanometer range comes more pressure on IC packaging technologies to meet the needs of new devices.

Lead-free Impact on Wafer Bumping & Wafer-level Packaging

11/01/2005  With the July 2006 date for implementation of the EU’s RoHS and WEEE Directives looming, most, if not all producers of electronic products are studying prospective technologies and looking for potential solutions for assembling products using lead-free solders.

Nanomaterials Promise Innovative Solutions

11/01/2005  In today’s rapidly changing packaging environment, board assemblers find themselves caught between two converging trend lines.

November 2005 Exclusive Feature: WAFER LEVEL TEST

Reliability testing using a highly parallel source-measure method



10/31/2005  Pete Hulbert, Keithley Instruments Inc., Cleveland, Ohio

New semiconductor materials and shrinking device dimensions have made reliability testing increasingly important because the gate dielectric behavior of modern devices isn't well understood, requiring the development of new device lifetime models. However, traditional test methods are time consuming and not suitable for new materials and shorter development cycles. A new approach...

Oki develops method to fabricate GaN-HEMT on silicon wafers

10/31/2005  October 31, 2005 - Oki Electric Industry Co. has developed a technique to fabricate transistors of gallium nitride (GaN) on silicon wafers instead of expensive silicon carbide, reports the Nikkei English News. Using this technique, Oki said it can manufacture chips with an output of around 100W for less than half the conventional cost.

September's Global Semiconductor Sales Rise 5.2%

10/31/2005  San Jose, Calif. — Worldwide semiconductor sales increased to $19.6 billion in September, a 5.2% increase from the $18.6 billion reported in August, reports the Semiconductor Industry Association (SIA).