Featured Content




IPC/JEDEC Lead-free Conference to Target Components, Assemblies

10/17/2005  Bannockburn, Ill. — IPC–Association Connecting Electronics Industries and JEDEC will host the 11th International Conference on Lead-free Electronic Components and Assemblies on December 6–8, 2005, in Boston. To help prepare for such issues as new alloys and materials evaluations, inspection changes, tin whiskers, reliability, and increased assembly costs, top experts will come together to deliver an educational program and technical conference.

Oki Electric reports high-amplification GaN transistor

10/17/2005  October 17, 2005 - Oki Electric Industry Co. Ltd., Tokyo, Japan, has unveiled the development of a gallium nitride high electron-mobility transistor (GaN-HEMT) formed on a silicon substrate.

Keithley Opens New Asia Offices, Expands Singapore Office

10/17/2005  Cleveland, Ohio — Keithley Instruments, Inc. is expanding its existing office in Singapore and opening two new offices in Malaysia for direct sales and support of its electrical test and measurement solutions, both significantly expanding its business presence in southeast Asia.

Samsung to pay $300M in DOJ DRAM deal

10/14/2005  October 14, 2005 - Samsung Electronics Co. Ltd. has agreed to pay a $300 million fine to the US Department of Justice regarding a single charge related to price-fixing allegations...

Eight new SEMI standards cover FPDs and MEMS

10/14/2005  October 13, 2005 - Semiconductor Equipment and Materials International (SEMI) has published eight new technical standards for the semiconductor, flat-panel display (FPD), and microelectromechanical systems (MEMS) manufacturing industries.

Speedline Receives Patent for Bridge Detection Method

10/14/2005  Franklin, Mass. — Speedline Technologies has received U.S. Patent #6,891,967 for its MPM BridgeVision inspection method. Awarded for its innovative analysis technique used to quantify both the amount and geometry of solder paste between printed deposits, the technique uses the solder paste's texture to identify its position relative to the smooth pad and solder mask. This method shows the difference between the gray solder paste and the dark solder mask.

Indium Grows Western U.S. Sales Team

10/12/2005  Utica, N.Y. — In efforts to provide enhanced customer service, Indium Corp. has expanded its sales team in the western U.S. Bill Macartney IV is the new U.S. Rocky Mountain regional sales manager, Tony Przano is the new Southwest regional sales manager, and Karthik Vijayamadhavan is the new area sales manager for the West Coast.

Wafer Shipments to Climb 2% in '05

10/12/2005  San Jose, Calif. — Leading silicon wafer suppliers predict that 2005's year-end wafer shipments will be 2% higher than 2004's. Also, total wafer shipments will increase by about 7% in 2006, according to the SEMI Silicon Manufacturers Group (SMG) Consensus Forecast. By surveying SMG members, the Consensus Forecast provides a silicon wafer shipment outlook for 2005 through 2008.

Nanosys, Sharp sign multiyear agreement on nanotech-enabled displays

10/12/2005  October 12, 2005 - Nanosys Inc. has entered into a multiyear development agreement with Sharp Corp., Osaka, Japan, to develop display technologies incorporating Nanosys' proprietary nanotechnology. Under the terms of this development agreement, Sharp will collaborate and support efforts at both Nanosys and Sharp. No other details were disclosed.

Report: Austin has inside track on new Samsung 300mm fab

10/11/2005  October 11, 2005 - Samsung Electronics could be on the verge of naming Austin, TX, as the home for its new $3.3 billion 300mm chip manufacturing site in the US.

Report: Korea trade group eyeing Samsung/Apple flash deal

10/11/2005  October 11, 2005 - Samsung Electronics may face scrutiny from South Korea's Fair Trade Commission (FTC) for an alleged sweetheart deal to supply NAND flash memory to Apple Computer for its iPod nano.

Energy efficient system found in "walking" protein

10/11/2005  October 11, 2005 - A protein called kinesin has a "walking" mechanism that is very energy efficient and could be used to develop future molecular-sized machines without worries about problems caused by heat, Japanese researchers said Monday, reports the Jiji Press.

Wafer shipments forecast to grow 2% in 2005, 7% in 2006

10/11/2005  October 11, 2005 - The leading suppliers of silicon wafers forecast year-end wafer shipments for 2005 to be 2% higher than 2004 shipments. According to SEMI's Silicon Manufacturers Group (SMG) Consensus Forecast, total wafer shipments will increase by about 7% in 2006. The Consensus Forecast, obtained through surveying SMG members, provides a silicon wafer shipment outlook for 2005 through 2008.