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Defined by association

10/01/2005  As an American citizen, I’m entitled to cast one vote each year at election time.

IEST-RP-CC028.1: Minienvironments

10/01/2005  This Recommended Practice (RP) published by the Institute of Environmental Sciences and Technology (IEST) is considered essential for individuals in industries that might benefit from the use of localized, enhanced contamination control.

Stacked Die & Multi-tier Applications

10/01/2005  New Capillary Addresses Looping Problems

USP 797: A work in progress-Part 2

10/01/2005  Facilities requiring compliance with USP 797 can be placed into two broad categories: a cleanroom that supports higher air quality environments such as clean benches and biological safety cabinets; and barrier isolators, which are not required to be placed into a cleanroom.

Pharmaceutical cleanroom trends

10/01/2005  The pharmaceutical/biotechnology industry is the second largest consumer of cleanroom space.

Food plant contamination: What you can’t see can kill you

10/01/2005  Controlling bacteria is a top priority for food processors waging the war against foodborne illness. Devising an effective strategy-which will vary by product-is half the battle.

MEMS: Poised for Success

10/01/2005  Diving competitions always draw my attention. Having the courage to align one’s body in a head-downward position from a precipice high above the water seems illogical, risky, and difficult.

Pb-free Design and Process Optimization for PIH

10/01/2005  This article examines results of the board design and process optimization for paste-in-hole (PIH) using lead-free solder.

Discovering Gold as a Lead-free Substitute

10/01/2005  The looming lead-free debacle is driving desperate alternative seekers to find proven lead-free flip chip bumping technologies.

Guarded Times for the Semiconductor Equipment Market

10/01/2005  The 2005 downcycle in the semiconductor capital equipment market is here. The good news is the current downcycle will be more of a “digestive” phase of the industry’s shallow over-capacity, rather than a deep industry recession as in 2001.

Flip Chip Solder Joint Failure Modes

10/01/2005  High Electric-Current Density Testing

IDCs: A Socketless Test Solution

10/01/2005  A STRESS-HARDWARE CONCEPT

Encapsulation and Modern Molding

10/01/2005  Next-generation Material Sets

End-of-Life Leaching of Lead and Other Elements

10/01/2005  There is much concern about what will happen when consumer electronics being stored in basements, garages, and attics reach municipal landfills.

Predicting Brittle Fracture Failures

10/01/2005  With expanded use of printed circuit board assemblies (PCBAs) containing lead-free BGA components, the challenge remains: how to predict and detect brittle fracture failures.

Freescale Names New VP/CIO

09/30/2005  Austin, Texas — Freescale Semiconductor has appointed Sam Coursen as its new VP and CIO, overseeing Freescale's strategic, operational, and financial information technology (IT) infrastructure.

FSA Suppliers Expo/Conference '05 Hits on Association Initiatives

09/30/2005  San Jose, Calif. — The Fabless Semiconductor Association (FSA) will host the FSA Annual Briefing during the 2005 FSA Suppliers Expo and Conference, to be held October 5–6, 2005, at the San Jose McEnery Convention Center in San Jose. The briefing will discuss the latest updates on FSA resources, tools, and initiatives, and will take place on October 5th from 4:00 – 5:00 p.m., and on October 6th from 8:00 – 9:00 a.m.

Honeywell Steps Up Titanium Sponge Production

09/30/2005  Tempe, Ariz. — Honeywell Electronic Materials is increasing production of titanium sponge to meet global demand for the material, which is the basic form of titanium. Since Honeywell produces titanium sponge for its own production of materials and products for the semiconductor industry, they have begun selling sponge externally to meet growing demand and plans to increase the amount available.

Infineon, Nanya extend DRAM pact

09/29/2005  September 29, 2005 - Infineon Technologies AG and Taiwan's Nanya Technology Corp. have expanded their existing 90-70nm/300mm DRAM technology development agreement to include 60nm process technologies.