09/16/2005 September 16, 2005 - At the recent 2nd International Symposium on Immersion Lithography, held in Brugges, Belgium, the Interuniversity MicroElectronics Center (IMEC) presented the first conclusive exposure results on its newly upgraded ASML XT:1250i immersion lithography tool.
09/16/2005 When Neil Wyant was a kid, he says he cut out of school to buy a bulk piece of chewing gum, then sell it off in pieces. So it was no surprise to family and friends that the entrepreneur is back to hawking gum, only now of the micro-enhanced, patent-pending, chocolate kind.
09/15/2005 Shanghai, China — Intel Corp. has established Asia-Pacific Research and Development Ltd. (Asia-Pacific R&D Ltd.) in China, based in Shanghai's Zizhu Science Park, to help enhance local R&D capabilities and to deliver time-to-market, customized platforms and solutions for markets across the Asia-Pacific region and the world.
09/15/2005 September 15, 2005 - Cree Inc. has been awarded a $15 million contract by the Department of Defense's Title III Program, which is administered by the Air Force Research Laboratory (AFRL). Under the new five-year contract, Cree will focus on advancing silicon carbide (SiC) microwave monolithic integrated circuit (MMIC) processing techniques to transition the production of SiC MMICs to 100mm substrates and reduce cost/chip.
09/15/2005 September 15, 2005 - Hitachi Displays Ltd. and NTT IT Corp. said Tuesday that they have jointly developed a display panel for three-dimensional images that does not strain the eye, even when viewed for long hours, reported Jiji.
09/15/2005 NanoOpto Corp., A Somerset, N.J., company that is applying novel design methods and proprietary nanofabrication technology to produce a broad range of optical components, announced that Nada O'Brien has joined the company as vice president of product development.
09/14/2005 September 14, 2005 - PennWell Corp. has named veteran technology editor Ed Korczynski to the position of senior technical editor of Solid State Technology magazine, effective yesterday.
09/14/2005 Carlsbad, Calif. — Asymtek, Dow Corning, Dymax, EMI, and Humiseal collectively will offer conformal coating workshops in Montreal and Toronto, Canada on October 11 and 13, 2005, respectively. Each one-day training program will teach attendees about the various types of available coatings, including silicone, acrylics, urethanes, UV-curable coatings, and adhesives. The most recent automated equipment options for mask-free conformal coating will also be covered.
09/13/2005 Migdal Ha'emek, Israel — Camtek Ltd. is introducing three new Falcon wafer AOI system models at SEMICON Taiwan, currently happening from September 12–14 in Taipei. The new models include Falcon 800 for 3-D metrology of gold- and solder-bumped wafers, Falcon 500PD for post-dicing wafer inspection, and Falcon 500 for general wafer inspection before or after test. The Falcon 800 model employs CTS, Camtek's own triangulation height measurement technology — key to its 3-D performance.
09/13/2005 Scotts Valley, Calif. — Carsem announces that M.H. Toh recently joined as Carsem's S-Site factory's general manager. He reports to S.W. Woo, Carsem's COO, and succeeds Alex Khor, who retired in June 2005. Toh has over 25 years of experience in the semiconductor industry with a background in both assembly and test operations, so he has held various management positions in production, quality assurance, and process engineering.
09/13/2005 September 13, 2005 - Entegris Inc. said today that it will divest three of its smaller product lines, including gas delivery components used in semiconductor production equipment, stainless steel clean-in-place equipment for life science applications, and tape-and-reel systems used in electronics manufacturing.
09/09/2005 September 9, 2005 - Scientists at Edinburgh University have developed a way of moving an object without touching it, a development especially useful in the area of nanotechnology, reported the Ediburgh, Scotland, Evening News. The team of researchers has been able to move objects across flat surfaces and even up a slope with nothing more than a light beam.
09/09/2005 Burbank, Calif. — Microfabrica and MOSIS have launched the EFAB Access Design Competition for microdevices. Offered by MOSIS, EFAB Access, a low-cost prototyping service for MEMS and microdevice development, is the first multi-project run service to offer Microfabrica's EFAB 3-D micromanufacturing technology. The three winning microdevice designs will be built free of charge through the EFAB Access program.
