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Diamond quantum sensor reveals current flows in next-gen materials

04/27/2017  World-first images of electric currents in graphene released.

First EUV lithography high-volume manufacturing solution for N5 BEOL

04/27/2017  Immersion-based self-aligned quadruple patterning is combined with EUV lithography block patterning to achieve metal layers with pitches as small as 32nm.

Entegris acquires MicroElectronics filtration product line from W. L. Gore & Associates

04/25/2017  The transaction expands Entegris' portfolio of filtration solutions for semiconductor, OLED and flat panel display applications.

Galaxy S8 materials costs highest by far compared to previous versions, IHS Markit teardown reveals

04/25/2017  The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions of the companyÂ’s smartphones, according to a preliminary estimate from IHS Markit.

Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in International Trade 2017

04/25/2017  SPTS Technologies announced today that it has been awarded the coveted Queen's Award for Enterprise in International Trade 2017.

Model for multivalley polaritons

04/25/2017  IBS scientists model the formation of multivalleys in semiconductor microcavities, bringing new ideas to the emerging valleytronics field

SEMICON Southeast Asia attendance surges on disruptive technology

04/25/2017  Today, SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year.

Former CEO files lawsuit against Cypress Semiconductor Board of Directors

04/24/2017  T.J. Rodgers, founder and former CEO of Cypress Semiconductor Corporation (NASDAQ: CY) and the Company's largest individual stockholder, today filed a lawsuit in the Delaware Court of Chancery seeking to compel the Cypress Board of Directors to make supplemental and corrective disclosures to address numerous material omissions and misstatements of fact in the Cypress Board's proxy materials.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

Analog DevicesÂ’ MEMS accelerometers deliver compelling noise performance for condition monitoring applications

04/24/2017  Analog Devices, Inc. (ADI) today announced two high frequency, low noise MEMS accelerometers designed specifically for industrial condition monitoring applications.

Chroma releases the newest semiconductor test solution

04/24/2017  Chroma ATE Inc. has recently released the newest semiconductor test solution for the IoT IC market.

Reducing down to 1/3 of thermal resistance by WOW technology for 3D DRAM application

04/24/2017  Researchers at Tokyo institute of Technology presented a design guide for reducing 30% of thermal resistance for 3-dimensional (3D) stacked devices compared with the conventional ICs using solder bump joint structure.

Conax Technologies announces the acquisition of Arizona-based Quartz Engineering

04/24/2017  Conax Technologies announced the acquisition of Quartz Engineering, a manufacturer of quartz sheaths for temperature sensors headquartered in Tempe, AZ.

Engineering technique is damaging materials, research reveals

04/21/2017  Widely used microscopy technique has unintended consequences, new Oxford University research reveals.

New quantum liquid crystals may play role in future of computers

04/21/2017  New state of matter may have applications in ultrafast quantum computers.

Avantor acquires Puritan Products

04/21/2017  Avantor Performance Materials, LLC, announced today the acquisition of Puritan Products, Inc., a supplier of cGMP buffers and solutions for Biopharma customers, and high-purity chemistries for Research and Electronic Materials customers.

Will I see you at The ConFab?

04/20/2017  The ConFab — an executive conference now in its 13th year — brings together influential executives from all parts of the semiconductor supply chain for three days of thought-provoking talks and panel discussions, networking events and select, pre-arranged breakout business meetings.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors