07/14/2005 Morristown, NJ --July 14, 2005--CSSC, a regulatory compliance and validation company, expands its global presence by partnering with ADN. CSSC and ADN, both leading providers of regulatory compliance solutions to the life sciences industry, announced today a strategic partnership.
07/14/2005 SAN FRANCISCO--(BUSINESS WIRE)--July 13, 2005--To help optimize the performance of heaters and electrostatic chucks in chip-making equipment, GE's Quartz business today announced an integrated heater assembly platform based at the company's new laboratory in Kobe, Japan.
07/14/2005 SAN FRANCISCO, CA -- (MARKET WIRE) -- 07/13/2005 -- Cost-conscious semiconductor suppliers can control their rapidly escalating R&D costs by piggybacking on the new collaborative model and fab resources that SEMATECH has made available to the industry, attendees at SEMICON West were told Tuesday.
07/14/2005 (July 14, 2005) San Francisco, Calif. — Top executives from the semiconductor equipment and materials industry engaged in a debate over the industry's future on SEMICON West's opening day. One question addressed was whether the center of the industry will inevitably shift away from North America toward Asia, reflecting the Asia-Pacific market's growing size and importance.
07/14/2005 July 14, 2005 - A panel of leading executives from the semiconductor equipment and materials industry engaged in a spirited debate over the future direction of the industry on the opening day of SEMICON West Tuesday night. Among the questions addressed is whether the center of the industry will inevitably shift away from North America toward Asia, reflecting the growing size and importance of the Asia-Pacific market.
07/14/2005 July 14, 2005 - ATMI Inc., a supplier of materials and materials packaging, has purchased a minority interest in Anji Microelectronics, a developer of advanced semiconductor materials located in Shanghai, China.
07/13/2005 (July 13, 2005) Jerusalem, Israel — Wafer-level electronics miniaturization technologies provider Shellcase Ltd. has licensed use of its wafer-level chip-size packaging (WLCSP) platforms to Suzhou, China-based packaging services provider China WLCSP.
07/13/2005 July 13, 2005 - ASM International N.V. and IMEC have announced that they have agreed to enter into a three year strategic partnership in the area of back-end-of-line (BEOL) interconnect technology, commencing in 2006.
