Featured Content




Hazards of molecular contamination grow over space and time

07/01/2005  More than 40 years ago, in the early 1960s, the space program began to experience firsthand the effects of molecular contamination. Problems were apparent within the optics-rich vacuum environments well before the first spacecraft was launched.

Sterile cleanroom consumables management

07/01/2005  When manufacturing in an aseptic environment, it is critical to ensure that the various cleanroom consumables, such as wipers, gloves, swabs, tubing, etc.

SoP for Multifunctional System Packages

07/01/2005  THROUGH THIN FILM COMPONENT INTEGRATION IN CONTRAST TO SIP WITH STACKED IC MODULES

Wafer environment nanoparticle contamination control and defect reduction in front-end-of-line (FEOL) cleaning processes

07/01/2005  The complexity of semiconductor device manufacturing processes is increasing as scaling of ICs continues with shrinking feature sizes. With this complexity, contamination control of nanosize particles is increasingly becoming more important during fabrication. The ITRS guidelines in Table 1 show the stringent purity requirements for liquid chemicals to be used in the manufacture of next-generation semiconductors.1

Touting the Next Big Thing

07/01/2005  Have you noticed how electronics experts are all searching for the next piece of news, the next new product that will blow away the competition, or that one bit of “secret stuff” that no one else knows about?

3-D Packaging: A Growing Level of Functional Integration

07/01/2005  Feature-rich cell phones, pocket PCs, digital cameras, and other handheld consumer products require maximum functional integration, including memory, DSP, ASIC, RF, MEMs, and other devices in the smallest footprint, lowest profile, and lowest cost package available.

Subcontractor Update: Uniformly Down in Q1, Optimism Looking Ahead

07/01/2005  The major assembly and test subcontractors started 2005 with financial results that were surprisingly uniform and generally as projected, but they were negative by most measures.

Effects on Packaging from the Progression of Wafer Technologies

07/01/2005  Consumer electronics today are demanding higher performance devices, smaller form factors, and lower power consumption.

Thermal Conductivity In Advanced Chips

07/01/2005  EMERGING GENERATION OF THERMAL GREASES OFFERS ADVANTAGES

Bearing Life: A Future Package Cooling Challenge

07/01/2005  THERMAL DESIGN FOR COOLING MICROPROCESSOR PACKAGES

Wire Bond Vs. Flip Chip Packaging

07/01/2005  A TECHNICAL TRADE-OFF ANALYSIS

Automation and Advanced Packaging Assembly

07/01/2005  IMPROVING THROUGHPUT, QUALITY, & YIELD

Testing for BGA Resistance to Brittle Fracture

07/01/2005  INDIVIDUAL BONDS CAN BE TESTED IMMEDIATELY AFTER REFLOW

Wire Bonding Tutorial

07/01/2005  Advances in Bonding Technology

Newport Procures 3.2 Million Shares from Thermo Electron

06/30/2005  (June 30, 2005) Irvine, Calif. — Newport Corp. has purchased the 3,220,300 shares of its common stock issued as part of the consideration for its purchase of Spectra-Physics from Thermo Electron Corp. back in July 2004. Newport paid $13.56 per share, or $43.7 million for the shares, determined by negotiation between Newport and Thermo Electron, and representing a discount from the average closing price of Newport common stock for the last 20 trading days.

ON Semiconductor to cut work force, transfer some operations to US

06/30/2005  June 30, 2005 - ON Semiconductor has announced its plan to transfer wafer-fab operations from its Site 2 facility in Seremban, Malaysia, to its facility in Phoenix by the end of 2006, resulting in the loss of ~80 jobs. As a result, the company expects to save a total of ~$25 to $30 million over the next five years, beginning in the 3Q06.

U.S. company, university establish research program with India

06/30/2005  Rutgers, The State University of New Jersey, and NEI Corp. announced they established a cooperative research program in nanotechnology with an Indian government R&D center.

Nanomix delivers second sensor product

06/30/2005  Nanomix Inc., an Emeryville, Calif., company commercializing a line of nanoelectronic detection devices for industrial and biomedical applications, announced the release of a second detection device based on its Sensation technology platform.

Rudolph and August sign definitive merger agreement

06/29/2005  June 29, 2005 - Rudolph Technologies Inc. has signed a definitive merger agreement with August Technology Corp. The transaction has been unanimously approved by the board of directors of both companies, is subject to customary regulatory approvals and shareholder vote of each company, and is expected to close in the 4Q05.